Preparation and research process of high thermal conductivity metal matrix composites

CHEN Zhen-rui; LIU Chao; XIE Yan-chong; PAN Zhi-zhong; REN Shu-bin; QU Xuan-hui

doi:10.19591/j.cnki.cn11-1974/tf.2021040002

Volume 40 Issue 1

Feb. 2022

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CHEN Zhen-rui, LIU Chao, XIE Yan-chong, PAN Zhi-zhong, REN Shu-bin, QU Xuan-hui. Preparation and research process of high thermal conductivity metal matrix composites[J]. Powder Metallurgy Technology, 2022, 40(1): 40-52. doi: 10.19591/j.cnki.cn11-1974/tf.2021040002

Citation:

CHEN Zhen-rui, LIU Chao, XIE Yan-chong, PAN Zhi-zhong, REN Shu-bin, QU Xuan-hui. Preparation and research process of high thermal conductivity metal matrix composites[J]. Powder Metallurgy Technology, 2022, 40(1): 40-52. doi: 10.19591/j.cnki.cn11-1974/tf.2021040002

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Preparation and research process of high thermal conductivity metal matrix composites

doi: 10.19591/j.cnki.cn11-1974/tf.2021040002

1.
Institute for Advances Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China
2.
Xiamen Tungsten Co., Ltd., Xiamen 361000, China
3.
Luoyang Golden Egret Geotools Co., Ltd., Luoyang 471000, China

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Corresponding author: E-mail: sbren@ustb.edu.cn
Received Date: 2021-04-07
Publish Date: 2022-02-28

Abstract

Abstract

With the increasing power of the electronic device chip, the higher requirements are put forward for the thermophysical properties of the heat dissipation materials. The metal matrix composites as the ideal heat dissipation material, which are composed of the high thermal conductivity and low thermal expansion reinforcement phase and the high thermal conductivity metal, show the high thermal conductivity and the adjustable coefficient of thermal expansion. The research progress of the copper matrix and aluminum matrix composites reinforced by Si, SiC_p, diamond, and flake graphite in recent years was summarized in this paper, and the existing problems and future research direction of the metal matrix composites were prospected.
- metal matrix composites,
- thermal conductivity,
- physical properties,
- research progress

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References(65)

References

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