微波烧结温度对CNTs/Cu复合材料结构和性能的影响

段柏华; 周宇; 王德志

doi:10.19591/j.cnki.cn11-1974/tf.2018.05.001

微波烧结温度对CNTs/Cu复合材料结构和性能的影响

段柏华^{1, 2, ,},
周宇¹,
王德志^{1, 2}

1.
中南大学材料科学与工程学院, 长沙 410083
2.
中南大学有色金属材料科学与工程教育部重点实验室, 长沙 410083

基金项目:

湖南省自然科学基金资助项目 2015JJ2170

国家自然科学基金资助项目 51274246

详细信息

通讯作者:
段柏华, E-mail: duan-bh@csu.edu.cn

中图分类号: TB331
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出版历程
- 收稿日期: 2018-03-14
- 刊出日期: 2018-10-26

Effect of microwave sintering temperature on microstructures and properties of CNTs/Cu composites

DUAN Bo-hua^{1, 2, ,},
ZHOU Yu¹,
WANG De-zhi^{1, 2}

1.
School of Materials Science and Engineering, Central South University, Changsha 410083, China
2.
Key Laboratory of Nonferrous Metal Materials Science and Engineering Ministry of Education, Central South University, Changsha 410083, China

More Information

Corresponding author:
DUAN Bo-hua, E-mail: duan-bh@csu.edu.cn

摘要

摘要: 结合液相混合方法、微波烧结技术和冷轧技术制备碳纳米管增强铜基（carbon nanotubes reinforced copper-matrix，CNTs/Cu）复合材料，研究不同烧结温度对于CNTs/Cu复合材料微观形貌、力学性能及物理性能的影响。结果表明，采用液相混合法制备出粒径为200~500 nm、碳纳米管质量分数为0.5%的CNTs/Cu复合粉体，碳纳米管均匀分散在铜颗粒中，并与之形成良好结合界面。CNTs/Cu复合材料的相对密度、硬度、电导率随着烧结温度的升高先增大后减小，在烧结温度为1000℃时达到最佳。制备的碳纳米管质量分数为0.5%的CNTs/Cu复合材料组织均匀、孔隙数量及尺寸较少，相对密度为95.79%，硬度为HV 80.9，电导率为81.8% IACS。经冷轧处理后，CNTs/Cu复合材料拉伸强度达到218 MPa，延伸率保持37.75%。由此可见，微波烧结技术是一种制备高性能CNTs/Cu复合材料的理想方法。
- 微波烧结 /
- 铜基复合材料 /
- 碳纳米管 /
- 烧结温度
Abstract: Carbon nanotubes reinforced copper-matrix (CNTs/Cu) composites were prepared by the combination of liquid phase method, microwave sintering, and rolling technology. The effects of sintering temperature on micromorphology, mechanical properties, and physical properties of CNTs/Cu composites were investigated. The results show that, 0.5% CNTs/Cu composite powders (mass fraction) are prepared by liquid phase method with the diameter of 200~500 nm, the carbon nanotubes are uniformly dispersed in copper particles, forming a good bonding interface with cooper. The relative density, hardness, and electrical conductivity of CNTs/Cu composites first increase and then decrease with the increase of sintering temperature. The optimum properties of 0.5% CNTs/Cu composites are obtained when the sintering temperature is 1000℃, which show the less pores and uniform distribution, the relative density reaches 95.79%, the hardness is HV 80.9, and the electrical conductivity is 81.8% IACS. Subsequent rolling process enables the better performance of sintered composites which shows the tensile strength of 218 MPa and the elongation of 37.75%. Thus, it can be seen that the microwave sintering technology is an ideal method for the preparation of high-performance CNTs/Cu composites.
- microwave sintering /
- copper-matrix composites /
- carbon nanotubes /
- sintering temperature

HTML全文

图 1 质量分数为0.5%CNTs/Cu复合粉末微观结构图: (a) 透射电子显微镜图; (b) 场发射扫描电镜图

Figure 1. Microstructures of 0.5%CNTs/Cu composite powders by mass: (a) TEM; (b) SEM

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图 2 质量分数为0.5%CNTs/Cu复合粉末X射线衍射图

Figure 2. XRD patterns 0.5%CNTs/Cu composite powders by mass

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图 3 不同烧结温度制备的质量分数为0.5% CNTs/Cu复合材料的显微形貌图：(a) 850 ℃；(b) 950 ℃；(c) 1000℃；(d) 1050℃；(e) 孔隙结构放大图

Figure 3. SEM images of microwave sintered 0.5% CNTs/Cu composites by mass at different temperatures: (a) 850 ℃; (b) 950 ℃; (c) 1000 ℃; (d) 1050 ℃; (e) higher magnification image of pores

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图 4 复合材料相对密度和体积收缩率与烧结温度的关系曲线

Figure 4. Relationship of relative density and volume shrinkage with sintering temperatures of composites

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图 5 复合材料硬度与烧结温度的关系曲线

Figure 5. Relationship between composites hardness and sintering temperatures

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图 6 复合材料电导率与烧结温度的关系曲线

Figure 6. Relationship between electrical conductivity of composites and sintering temperatures

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图 7 不同烧结温度下复合材料的应力应变曲线: (a) 850℃; (b) 950℃; (c) 1000℃; (d) 1050℃

Figure 7. Stress-strain curves of CNTs/Cu composites by different sintering temperatures: (a) 850℃; (b) 950℃; (c) 1000℃; (d) 1050℃

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图 8 烧结温度对机械性能的影响

Figure 8. Relationship between mechanical properties of composites and sintering temperatures

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图 9 不同烧结温度下CNTs/Cu复合材料的断口形貌：(a) 850 ℃；(b) 950 ℃；(c) 1000℃；(d) 1050℃；(e) 孔隙结构放大图

Figure 9. Fracture morphologies of CNTs/Cu composites at different sintering temperatures: (a) 850℃; (b) 950 ℃; (c) 1000 ℃; (d) 1050 ℃; (e) higher magnification image

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