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搅拌球磨磨制片状银粉工艺研究

Research on the process of grinding flake silver powder by ball-stirring mill

  • 摘要: 通过搅拌球磨的方式在不同球磨助剂及球磨时间下,利用不同比表面积的前驱体磨制了片状银粉。采用激光粒度分布仪、扫描电子显微镜、比表面测试仪及松装、振实密度测试仪等设备研究了片状银粉的物理性能及导电性。结果表明:在球磨介质、料球比确定的前提下,使用比表面积为0.50 m2/g左右、分散性良好的类球形银粉为前驱体,以硬脂酸为球磨助剂,控制球磨时间为12 h,可制备得到方阻值不高于15 Ω/□的片状银粉,该银粉适用于导电银浆。

     

    Abstract: The flake silver powders were grinded by stirring ball milling with different milling aids at different milling times, using the precursors in different specific surface areas. The physical properties and electrical conductivity of flake silver powders were investigated by laser particle size distribution (PSD) instrument, scanning electron microscope (SEM), specific surface area (SSA) tester, and the test devices for apparent density and tap density. In the results, when the ball mill medium and the ball-to-powder weight ratio are determined, the flake silver powders with the sheet resistance no more than 15 Ω/□ can be prepared by using spherical silver powders as the precursor with the excellent dispersibility at the specific surface area of~0.50 m2/g, the stearic acid is chosen as the milling aids, and the milling time is controlled as 12 h. The prepared flake silver powders are suitable for the conductive silver paste production.

     

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