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烧结温度对Ti(C,N)-HfN/Ti(C,N)-WC层状陶瓷微观组织和力学性能的影响

Effect of sintering temperature on microstructure and mechanical properties of Ti(C,N)-HfN/Ti(C,N)-WC laminated ceramics

  • 摘要: 以Ti(C,N)为基体相,HfN和WC为不同层的增强相,金属Ni和Mo为粘结相,采用交替铺层法制备素坯,并利用真空热压烧结技术制备Ti(C,N)-HfN/Ti(C,N)-WC层状陶瓷,研究了烧结温度对层状陶瓷微观组织和力学性能的影响。结果表明:随着烧结温度的升高,材料中的晶粒逐渐长大,在烧结温度为1350 ℃和1400 ℃时,材料的晶粒较小但分布不均匀,且存在较多的微缺陷;在烧结温度为1450 ℃和1500 ℃时,材料中的晶粒相对均匀(粒径~1 μm),微缺陷较少;在烧结温度达到1550 ℃时,材料中出现了大量粗大晶粒(粒径~2 μm)。随着烧结温度的升高,层状陶瓷的抗弯强度、维氏硬度和断裂韧度均先增大后减小。在1450 ℃下所制备的Ti(C,N)-HfN/Ti(C,N)-WC层状陶瓷具有较好的综合力学性能,其抗弯强度、维氏硬度和断裂韧度分别为(1263.6±17.1)MPa、(18.5±0.3)GPa和(8.2±0.1)MPa·m1/2。此外,Ti(C,N)-HfN/Ti(C,N)-WC层状陶瓷在断裂时表现为穿晶与沿晶并存的断裂模式。

     

    Abstract: Ti(C,N)-HfN/Ti(C,N)-WC laminated ceramics were prepared by alternately making layer method and vacuum hot pressing sintering technology, using Ti(C,N) as the matrix phase, HfN and WC as the reinforced phases for the different layers, and metal Ni and Mo as the binder phases. The effects of sintering temperature on the microstructure and mechanical properties of the laminated ceramics were investigated. The results show that with the increase of sintering temperature, the grains grow up gradually. When the sintering temperature is 1350 ℃ and 1400 ℃, the grains are small but unevenly distributed with many micro-defects. At the sintering temperature of 1450 ℃ and 1500 ℃, the grains are uniform (~1 μm) and there are fewer micro-defects. However, when the sintering temperature reaches 1550 ℃, a large number of coarse grains (~2 μm) appear. Moreover, with the increase of the sintering temperature, the flexural strength, Vickers hardness, and fracture toughness of the laminated ceramics increase first and then decrease. The laminated ceramic sintered at 1450 ℃ shows the better comprehensive mechanical properties, the flexural strength, Vickers hardness, and fracture toughness are (1263.6±17.1) MPa, (18.5±0.3) GPa, and (8.2±0.1) MPa·m1/2, respectively. In addition, the Ti(C,N)-HfN/Ti(C,N)-WC laminated ceramics exhibit the co-existence model of intergranular fracture and transgranular fracture.

     

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