Effects of surface state for Mo–Cu interlayer materials on interface bonding of multi-layer Cu/MoCu/Cu composites
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摘要:
采用粉末冶金熔渗法制备Mo–30Cu合金板坯，Mo–30Cu板坯和无氧铜板经轧制后在30 MPa、970 ℃的条件下进行热压复合，制得5层铜/钼铜/铜（Cu/MoCu/Cu，CPC）复合材料。通过金相组织观察、超声波扫描分析、高温热考核、漏气率测试等方法，研究了不同Mo–30Cu芯材表面处理方式对多层CPC复合材料层间结合强度的影响。结果表明，采用拉丝处理的Mo–30Cu芯材制备的多层CPC复合材料经830 ℃高温烘烤10 min热考核后，材料内部无空洞缺陷，漏气率小于5×10−3 Pa·cm3·s−1。采用研磨处理的Mo–30Cu芯材所制备的多层CPC复合材料经热考核后，材料出现鼓包现象，内部存在明显空洞缺陷，漏气率大于5×10−3 Pa·cm3·s−1。
Abstract:Mo–30Cu alloy billets were prepared by powder metallurgy infiltration method, the rolled Mo–30Cu billets and oxygen-free copper plates were hot-pressed at 970 ℃ with a pressure of 30 MPa to obtain 5-layer Cu/MoCu/Cu (CPC) composites. The effects of the Mo–30Cu surface treatments on the interface bonding strength of the multi-layer CPC composites were studied by the microstructure observation, ultrasonic scanning analysis, high-temperature thermal examination, and air leakage rate testing. The results show that, the multi-layer CPC composites prepared by Mo–30Cu interlayer materials treated by wiredrawing have no cavity defects after being heated at 830 ℃ for 10 min, and the leakage rate is less than 5×10−3 Pa·cm3·s−1. The multi-layer CPC composites prepared by Mo–30Cu interlayer materials treated by grinding show the bulging phenomenon after the thermal examination, have the obvious cavity defects in the interior, and the leakage rate is greater than 5×10−3 Pa·cm3·s−1.
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图 1 Mo–30Cu芯材表面和断面扫描电子显微形貌：（a）表面形貌；（b）断口形貌
Figure 1. SEM images of the surface and fracture for the Mo–30Cu interlayers: (a) surface; (b) fracture
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图 2 经过表面处理后的Mo–30Cu芯材表面：（a）研磨处理；（b）拉丝处理
Figure 2. Surface of the Mo–30Cu interlayers after surface treatment: (a) grinding processing; (b) wiredrawing processing
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图 4 5层CPC复合材料830 ℃热考核后外观状态：（a）研磨处理（b）拉丝处理
Figure 4. Appearance of the 5-layer CPC composites after the thermal treatment at 830 ℃: (a) grinding processing; (b) wiredrawing processing
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图 5 研磨态芯材制备的5层CPC复合材料热考核后超声波扫描电子显微形貌：（a）仅台阶位置鼓包产品；（b）上下面均有鼓包产品
Figure 5. SAM images of the 5-layer CPC composites prepared by grind interlayer after thermal treatment: (a) products with bulge packs only at the step position; (b) products with bulge packs on both top and bottom
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图 7 失效的5层CPC复合材料界面超声波扫描显微形貌
Figure 7. SAM image of the failed 5-layer CPC composite interface
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图 8 拉丝态芯材制备的5层CPC复合材料在不同工序后的超声波扫描显微镜照片：（a）CPC复合板材；（b）CPC裸片零件；（c）电镀镍热考核CPC零件
Figure 8. SAM image of the 5-layer CPC composites prepared by wiredrawing: (a) CPC composite plate; (b) non-coating CPC product; (c) nickel-coating CPC product after thermal treatment
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图 9 拉丝态芯材制备的5层CPC复合材料热考核后体视显微镜照片
Figure 9. Stereoscopic microscope image of the 5-layer CPC composites prepared by wiredrawing after thermal treatment
表 1 Mo–30Cu芯材化学成分（质量分数）
Table 1 Chemical composition of the Mo–30Cu interlayers
% Cu Fe K Al Si Ca Mo 29.1200 0.0017 0.0042 0.0015 0.0010 0.0004 余量 
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表 2 拉丝态芯材和研磨态芯材制备的5层CPC复合材料漏气率
Table 2 Leakage rate of the 5-layer CPC composites prepared by wiredrawing and grinding
芯材表面处理 漏气率 / (Pa·cm3·s−1) 热压后裸片 电镀镍 热考核 拉丝态芯材 0.26×10−3 0.38×10−3 0.40×10−3 研磨态芯材 6.60×10−3 6.80×10−3 9.70×10−3
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