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溶胶凝胶/氢还原工艺制备超细Cu–20W复合粉末及其烧结性能

Preparation and sintering behavior of ultrafine Cu–20W composite powders by sol–gel with hydrogen reduction technology

  • 摘要: 以偏钨酸铵和硝酸铜为原料,采用溶胶–凝胶法结合氢还原制备了Cu–20%W(质量分数)超细粉末,经压制烧结获得Cu–20W复合材料。对粉体的形貌和粒度进行表征,并考察烧结温度对Cu–20W烧结体试样组织和性能的影响。结果表明:通过溶胶–凝胶法结合氢还原可制备出平均粒度小于100 nm的Cu–20W复合粉末;随烧结温度的升高,Cu–20W烧结体试样的物理性能和力学性能提高。1080 ℃烧结所得试样的相对密度达97.20%,电导率(IACS)、热导率、显微硬度和抗拉强度分别达到91.73%、351.52 W·m−1·K−1、HV 96.1和431.03 MPa;在100~400 ℃温度范围内,Cu–20W试样的热膨胀系数在14.871×10−6~17.422×10−6·K−1

     

    Abstract: Cu–20%W (mass fraction) ultrafine composite powders were prepared by the combination of sol–gel with hydrogen reduction method, using ammonium metatungstate and copper nitrate as the raw materials, and the Cu–20W samples were obtained by pressing and sintering. The morphology and particle size of the powders were characterized, and the effects of sintering temperatures on the microstructure and properties of the Cu–20W sintered samples were investigated. The results show that the Cu–20W composite powders are obtained by the combination of sol–gel with hydrogen reduction method with the average particle size of less than 100 nm. With the increase of sintering temperature, the physical and mechanical properties of the sintered Cu–20W samples are improved. The relative density of the samples sintered at 1080 ℃ is 97.20%, the electrical conductivity (IACS), thermal conductivity, Vickers hardness, and tensile strength are reached as 91.73%, 351.52 W·m–1·K–1, HV 96.1, and 431.03 MPa, respectively. In the temperature range of 100~400 ℃, the coefficient of thermal expansion for the sintered Cu–20W samples is 14.871×10–6~17.422×10–6·K–1.

     

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