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仵明杰, 张信哲, 赵建国, 赵元超, 张怀龙, 郭亚杰. 诱导Cu含量对Mo–Cu复合材料微观组织及热性能的影响[J]. 粉末冶金技术. DOI: 10.19591/j.cnki.cn11-1974/tf.2023060006
引用本文: 仵明杰, 张信哲, 赵建国, 赵元超, 张怀龙, 郭亚杰. 诱导Cu含量对Mo–Cu复合材料微观组织及热性能的影响[J]. 粉末冶金技术. DOI: 10.19591/j.cnki.cn11-1974/tf.2023060006
WU Mingjie, ZHANG Xinzhe, ZHAO Jianguo, ZHAO Yuanchao, ZHANG Huailong, GUO Yajie. Effects of induced Cu content on the microstructure and thermal properties of Mo–Cu composites[J]. Powder Metallurgy Technology. DOI: 10.19591/j.cnki.cn11-1974/tf.2023060006
Citation: WU Mingjie, ZHANG Xinzhe, ZHAO Jianguo, ZHAO Yuanchao, ZHANG Huailong, GUO Yajie. Effects of induced Cu content on the microstructure and thermal properties of Mo–Cu composites[J]. Powder Metallurgy Technology. DOI: 10.19591/j.cnki.cn11-1974/tf.2023060006

诱导Cu含量对Mo–Cu复合材料微观组织及热性能的影响

Effects of induced Cu content on the microstructure and thermal properties of Mo–Cu composites

  • 摘要: 采用诱导熔渗法制备Mo–Cu复合材料,通过调节诱导Cu质量分数(0~30%)制备出不同Cu含量的Mo–Cu复合材料,研究诱导Cu含量对复合材料微观形貌和性能的影响。结果表明:诱导Cu含量显著影响Mo–Cu复合材料的微观组织,当诱导Cu质量分数由0%逐步增加至20%,复合材料的孔隙大幅减少,Mo、Cu两相分布更加均匀,组织内单相偏聚的现象减少;但当诱导Cu质量分数达30%时,复合材料组织均匀性变差,孔隙数量不降反升。Mo–Cu复合材料的电导率和热导率随着复合材料中最终Cu含量的增加而增大。当最终Cu质量分数为40.46%时,复合材料的相对密度最大,为98.1%,对应的电导率和热导率也达到最高值,分别为52.69 %IACS和203.94 W·m−1·K−1。但另一方面,复合材料的热膨胀系数随最终Cu含量的增加也随之增大。在调控诱导Cu含量的基础上,探寻适宜的熔渗工艺,有望制备出综合性能更佳的Mo–Cu复合材料。

     

    Abstract: Mo–Cu composites were fabricated by induced infiltration method. Mo–Cu composites with different Cu contents were prepared by adjusting the induced Cu mass fraction (0~30%). The effects of induced Cu content on the microstructure and properties of the composites were studied. The results show that the content of the induced Cu significantly influences the microstructure of the Mo–Cu composites. When the mass fraction of the induced Cu gradually increases from 0% to 20%, the porosity of the composite is greatly reduced, the distribution of Mo and Cu phases is more uniform, and the single-phase segregation in the microstructure is reduced. However, when the mass fraction of the induced Cu increases to 30%, the microstructure uniformity of the composites becomes worse and the number of pores increases significantly. The electrical conductivity and thermal conductivity of the Mo–Cu composites increase with the increase of the final Cu content in the composites. When the final Cu mass fraction is 40.46%, the relative density of the composite reaches to the peak of 98.1%. Correspondingly, the electrical conductivity and thermal conductivity of the composite are also the highest values, which are 52.69 %IACS and 203.94 W·m−1·K−1, respectively. Unexpectedly, the thermal expansion coefficient of the composites also increases with the increase of the final Cu content. The combination of regulating the induced Cu and exploring suitable infiltration processes is expected to obtain the Mo–Cu composites with improved comprehensive properties.

     

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