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尹敏, 王建. 电子束粉末床熔融增材制造装备和工艺研究进展[J]. 粉末冶金技术. DOI: 10.19591/j.cnki.cn11-1974/tf.2023070008
引用本文: 尹敏, 王建. 电子束粉末床熔融增材制造装备和工艺研究进展[J]. 粉末冶金技术. DOI: 10.19591/j.cnki.cn11-1974/tf.2023070008
Research Progress in Equipment and Processes of Electron Beam Powder Bed Fusion Additive Manufacturing[J]. Powder Metallurgy Technology. DOI: 10.19591/j.cnki.cn11-1974/tf.2023070008
Citation: Research Progress in Equipment and Processes of Electron Beam Powder Bed Fusion Additive Manufacturing[J]. Powder Metallurgy Technology. DOI: 10.19591/j.cnki.cn11-1974/tf.2023070008

电子束粉末床熔融增材制造装备和工艺研究进展

Research Progress in Equipment and Processes of Electron Beam Powder Bed Fusion Additive Manufacturing

  • 摘要: 电子束粉末床熔融增材制造技术具有功率大、能量利用率高、扫描速度快、成形应力低、真空环境成形等突出特点,是国内外竞相发展和应用的金属增材制造技术之一。近年来,国内外在电子束粉末床熔融增材制造装备和工艺方面取得多项突破性进展,长期困扰该技术创新发展应用的成形尺寸小和电子枪阴极寿命短等问题已经得到了有效解决,并且涌现出了多种新成形工艺和成形质量在线监控技术,在高熔点、高反射率、脆性难加工金属材料复杂构件增材制造方面展现出更加广阔的应用前景。本文从装备发展、在线监控和成形工艺三个方面,对近年来国内外在电子束粉末床熔融增材制造技术方面的新进展进行了综述,并对其发展趋势、面临的技术挑战和应用前景进行了分析和展望。

     

    Abstract: Electron beam powder bed fusion (EB-PBF), as an important meta additive manufacturing technology, has outstanding characteristics such as high power, high energy utilization, fast scanning speed, low forming stress, and vacuum environment forming,and attracts increasing attention in academics and industry. In recent years, many breakthroughs have been made for EB-PBF system and process.The problems that have long plagued the innovative development and application of this technology, such as small forming dimensions and short life of cathode, have been preliminary solved, and multiple new forming processes and online monitoring technologies for forming quality have emerged, the additive manufacturing of complex components made of high melting point, high activity,brittle and difficult to machine metal materials has shown broader application prospects. This article reviews the new developments in EB-PBF additive manufacturing technology both domestically and internationally from three aspects: system technology,forming process, and process monitoring. It also analyzes and prospects its development trends, technological challenges, and application prospects.

     

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