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层厚比对TiC-WC/TiC-TiN层状陶瓷微观结构及力学性能的影响

Effect of layer thickness ratio on microstructure and mechanical propertiees of TiC-WC/TiC-TiN laminated ceramics

  • 摘要: 以TiC为基体材料,WC和TiN分别为TiC-WC(简称TW)层和TiC-TiN(简称TT)层的添加相,采用干压成型法和真空热压烧结技术,制备了五种不同层厚比(分别为2:1、1:1、1:2、1:3和1:4)的TW/TT层状陶瓷,研究了层厚比对其内部残余应力、微观结构以及力学性能的影响。结果表明,TW层中存在残余压应力,且残余压应力随着层厚比的增加逐渐增大,反之,TT层中存在的残余拉应力逐渐减小。随着层厚比的增大,TW层的硬度和断裂韧性以及层状陶瓷的相对密度和抗弯强度均先增大后减小,而TT层的断裂韧性和硬度整体呈下降趋势。当层厚比为1:3时,层状陶瓷的微观形貌缺陷较少,晶粒大小均匀,获得了最佳的力学性能,其抗弯强度为(946.01±19.1) MPa,此时,其TW层硬度和断裂韧性分别为(16.68±0.17) GPa和(10.19±0.22) MPa·m1/2,TT层的硬度和断裂韧性分别为(15.73±0.15) GPa和(7.78±0.26) MPa·m1/2。同时观察到TT层的平均晶粒尺寸明显小于TW层;裂纹在穿越层交界处时出现裂纹偏转和裂纹桥连,断裂方式为穿晶断裂和沿晶断裂。

     

    Abstract: The TW/TT layered ceramics with five different layer thickness ratios(2:1、1:1、1:2、1:3 and 1:4, respectively) were prepared by dry pressing and vacuum hot pressing sintering technology with TiC as the matrix phase of each layer, WC and TiN as the additive phases of TiC-WC (TW) layer and TiC-TiN(TT)layer, respectively. The effects of layer thickness ratio on the residual stress, microstructure and mechanical properties were investigated. The results showed that there were residual compressive stresses in the TW layer, and the residual compressive stresses gradually increased with the increase of layer thickness ratio, and conversely, the tensile stresses presented in the TT layer gradually decreased. With the increase of the layer thickness ratio, the hardness and fracture toughness of the TW layer as well as the relative density and flexural strength of the material were first increased and then decreased, whereas the fracture toughness and hardness of the TT layer showed an decreasing trend. When the layer thickness ratio was 1:3, the fracture profile had higher density and fewer defects, and the best mechanical properties were obtained, its flexural strength was (946.01±19.1) MPa; Its hardness and fracture toughness in TW were (16.68±0.17) GPa and (10.19±0.22) MPa?m1/2, respectively; Those in TT were (15.73±0.15) GPa and (7.78±0.26) MPa?m1/2, respectively. It was also observed that the average grain size of the TT layer was significantly smaller than that of the TW layer. Crack deflection and crack bridging occured when the crack crossed the layer junction, and the fracture mode was dominated by transgranular fracture and intergranular fracture.

     

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