Abstract: Using gas-atomized Cu–Al2O3 composite powder prepared via internal oxidation as feedstock, Al2O3 dispersion-strengthened copper deposits were fabricated on TC18 titanium alloy substrates through cold spraying, followed by post-deposition annealing treatments at 600℃ and 900℃. The microstructures of both the composite powder and cold-sprayed deposits were characterized by scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS), and X-ray diffraction (XRD). The effects of annealing on the microstructure, electrical conductivity, hardness, and wear resistance of the deposits were systematically investigated. The results revealed three distinct morphologies of Al2O3 particles in the composite powder: (1) near-spherical nanoparticles (average size: 14 nm) uniformly dispersed within the Cu matrix; (2) rod-shaped and equiaxed submicron particles (average size: 100 nm) with lower distribution density near the Cu matrix subsurface; (3) elongated rods and ellipsoids (major axis >800 nm) located at the Cu matrix surface. The cold-sprayed deposits inherited the powder's refined microstructure, exhibiting a dual-scale dispersion structure: predominant strengthening by Al2O3 nanoparticles, supplemented by 100-800 nm Al2O3 particles near powder boundaries. The 900℃-annealed Al2O3 dispersion-strengthened copper demonstrated superior comprehensive performance with hardness of HV 153.7±1.9 and electrical conductivity of 82.3±2.9% IACS, exceeding the properties of conventional powder metallurgy counterparts. The volume wear rate of Al2O3 dispersion strengthened copper deposit annealed at 900 ℃ is 5.05×10?4 mm3? (N ? m)?1, which is 25 % lower than that of as-sprayed Al2O3 dispersion strengthened copper.