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冷喷涂Al2O3弥散强化铜的组织和性能

Microstructure and properties of Al2O3 dispersion-strengthened copper fabricated by cold spraying

  • 摘要: 采用气雾化结合内氧化制备Cu–Al2O3复合粉末为原料,在TC18合金基板上通过冷喷涂制备了Al2O3弥散强化铜沉积体,并对沉积体进行退火热处理(600 ℃、900 ℃)。采用扫描电子显微镜、能谱分析仪、X射线衍射仪分析研究了Cu–Al2O3复合粉末与冷喷涂沉积体的微观组织,以及退火热处理对冷喷涂沉积体微观组织、电导率、硬度和耐磨性能的影响。结果表明:Cu–Al2O3复合粉末中Al2O3颗粒以三种形态存在,第一类以平均尺寸14 nm的近球形颗粒均匀弥散分布于Cu基体内部;第二类为平均粒径100 nm的棒状和等轴状颗粒,分布于Cu基体近表面,分布密度低于Cu基体内部;第三类为长轴尺寸超过800 nm的棒状、椭球状颗粒,分布于Cu基体表面。冷喷涂能够使沉积体直接继承复合粉末的微细结构,形成了纳米Al2O3弥散强化Cu结构为主、百纳米级Al2O3在粉末颗粒边界附近弥散强化为辅的结构。900 ℃退火Al2O3弥散强化铜沉积体的硬度与电导率分别达到了HV (153.7±1.9)和(82.3±2.9)%IACS,具有较高的综合性能,超过了传统粉末冶金方法制备的同成分Al2O3弥散强化铜。900 ℃退火Al2O3弥散强化铜沉积体的体积磨损率为5.05×10−4 mm3·(N·m)−1,较喷涂态Al2O3弥散强化铜减小了25%。

     

    Abstract: Cu–Al2O3 composite powders were fabricated by gas atomization combined with internal oxidation, using as the raw materials to prepare the Al2O3 dispersion-strengthened copper deposits on TC18 alloy substrate by cold spraying. The deposits were subsequently annealed at 600 ℃ and 900 ℃, respectively. Scanning electron microscope, energy dispersive spectrometer, and X-ray diffractometer were adopted to characterize the microstructures of Cu–Al2O3 composite powders and cold-sprayed deposits. The effects of annealing treatment on microstructure, electrical conductivity, hardness, and wear resistance of the deposits were investigated. The results show that the Al2O3 particles exist in three morphologies in Cu–Al2O3 composite powders. The first type presents nearly spherical particles with an average size of 14 nm, uniformly dispersed inside the copper matrix. The second type consists of the rod-shaped and equiaxed particles with an average particle size of 100 nm, distributed near the matrix surface with lower density than internal particles. The third type refers to rod-like and ellipsoidal particles with major axis length exceeding 800 nm, located on the copper matrix surface. Cold spraying enables the deposits to retain the fine microstructure of composite powders. The obtained structure is dominated by copper matrix strengthened by dispersed nano-scale Al2O3 particles, supplemented by dispersion strengthening of hundred-nanometer Al2O3 particles near powder boundaries. After annealing at 900 ℃, the hardness and electrical conductivity of the Al2O3 dispersion-strengthened copper deposits reach HV (153.7±1.9) and (82.3±2.9)%IACS, respectively, delivering the superior comprehensive properties compared with counterparts prepared by the conventional powder metallurgy. The volume wear rate of the 900 ℃-annealed deposits is 5.05×10−4 mm3·(N·m)−1, which is 25% lower than that of the as-sprayed samples.

     

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