高级检索

选择性激光熔融和热压烧结制备CuSnTi/金刚石复合材料工艺优化与组织性能研究

Process optimization and microstructure properties of CuSnTi/diamond composites prepared by selective laser melting and hot-pressing sintering

  • 摘要: 本研究分别采用响应曲面法和正交实验设计,对选择性激光熔融(SLM)与热压烧结(HPS)制备铜基金刚石复合材料的关键工艺参数进行了系统优化。结果表明:SLM工艺在激光功率260 W、扫描速度216 mm/s、扫描间距0.06 mm时达到致密度峰值(88.67%);其致密度受主效应与交互效应共同影响,各因素影响显著性排序为:激光功率 > 扫描间距 > 扫描速度。相比之下,HPS工艺在烧结温度805 ℃、保温时间9 min、保压压力50 MPa时获得最高致密度(94.92%);该过程仅受主效应控制,无显著交互效应,影响排序为:烧结温度 > 保压压力 > 保温时间。微观组织与性能表征显示,经工艺优化后,HPS试样的综合性能显著优于SLM试样。尽管两种工艺制备的复合材料中金刚石均未发生石墨化,但SLM试样内部存在大尺寸气孔与裂纹等缺陷,而HPS试样仅含少量孔隙。在金刚石形貌方面,SLM试样中的金刚石颗粒出现明显的破碎与脱落现象;反观HPS试样,金刚石颗粒保持完整,且界面结合更为紧密,展现出优于SLM工艺的把持力。本研究揭示了工艺参数对材料微观结构的影响机制,为开发高硬度铜基金刚石复合材料提供了重要的工艺参考。

     

    Abstract: In this study, the key process parameters for selective laser melting (SLM) and hot-pressing sintering (HPS) were systematically optimized using response surface methodology and orthogonal experimental design, respectively. The results indicate that the SLM process achieved a peak density of 88.67% at a laser power of 260 W, a scanning speed of 216 mm/s, and a scan spacing of 0.06 mm. Within the SLM process, both main and interaction effects were observed, with the order of influence being: laser power > scan spacing > scan speed. Conversely, the HPS process achieved a peak density of 94.92% at a sintering temperature of 805 °C, a holding time of 9 min, and a holding pressure of 50 MPa. Notably, the HPS process was governed solely by main effects—specifically sintering temperature>holding pressure>holding time—without significant interaction effects. Following optimization, the microstructure and properties of the composites fabricated via HPS were found to be superior to those produced via SLM. A comparative microstructural analysis revealed that while diamond particles in both composites avoided graphitization, the SLM-fabricated composite exhibited defects such as macropores and cracks, whereas the HPS-fabricated composite contained only minimal porosity. Furthermore, diamond particles in the SLM composites showed signs of fragmentation and debonding, whereas those in the HPS composites remained more intact, demonstrating superior morphological retention. This work provides valuable insights for the development of high-hardness copper-diamond composites using different processing routes.

     

/

返回文章
返回