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微晶CuCr50真空断路器触头材料的研制

崔建国, 杨志懋, 丁秉钧

崔建国, 杨志懋, 丁秉钧. 微晶CuCr50真空断路器触头材料的研制[J]. 粉末冶金技术, 1997, 15(1): 33-37.
引用本文: 崔建国, 杨志懋, 丁秉钧. 微晶CuCr50真空断路器触头材料的研制[J]. 粉末冶金技术, 1997, 15(1): 33-37.
Cui Jianguo, Yang Zhimao, Ding Bingjun. Investigation of Contact Materials for Microcrystal CuCr50 Vacuum Breaker[J]. Powder Metallurgy Technology, 1997, 15(1): 33-37.
Citation: Cui Jianguo, Yang Zhimao, Ding Bingjun. Investigation of Contact Materials for Microcrystal CuCr50 Vacuum Breaker[J]. Powder Metallurgy Technology, 1997, 15(1): 33-37.

微晶CuCr50真空断路器触头材料的研制

基金项目: 

国家自然科学基金资助项目

详细信息
    作者简介:

    崔建国,西安交通大学材料科学与工程系94级硕士研究生

Investigation of Contact Materials for Microcrystal CuCr50 Vacuum Breaker

  • 摘要: 采用高能球磨法制取CuCr50合金粉,在真空炉内热压成致密块体,利用扫描电镜、X-ray衍射仪、能谱仪等考察了球磨过程粉末粒度、形貌的变化,热压块体的显微组织以及其密度随温度、时间的变化。
    Abstract: CuCr50 alloy powder was made by high energy ball milling process and compacted into dense compact by hot pressing in vacuum furnace. The particle size, change of morphology, microstructure of hot pressed compact and its density change with temperature and time during milling process were reviewed by using scanning electronic microscope, X ray diffractometer, nelgy spectrometer, etc.
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出版历程
  • 收稿日期:  1996-06-19
  • 网络出版日期:  2021-07-20

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