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金属-金刚石的粘结界面与金刚石表面的金属化

BlNDED INTERFACE BETWEEN METAL AND DIAMOND AND METALLIZATION OF DIAMOND SURFACE

  • 摘要: 研究了在铜基合金中添加强碳化物形成元素,在液相下通过与金刚石表面的界面反应而改变了金刚石与合金的界面形态,从而实现合金对金刚石的粘结。进一步提出了金刚石表面金属化的模型和技术途径。这种表面金属化的金刚石颗粒具有一般金属颗粒的可烧结性、可焊接性及表面可导电(可电镀)性。强化了粉末治金或电镀金属基体对金刚石颗粒的粘结力,可大幅度提高金刚石工具的水平。

     

    Abstract: The present paper has dealt with the changes of interface state between diamond and alloy by interface reaction between copper-based alloy, into which strong carbide forming elements were addcd, and diamond surface under the condition of liquid phase with a result of achieving welding with diamond. Furthermore, the model of the metallization of diamond surface and technical process have been put forward.The diamond particles with metallized surface have much the same sinterability, weldability and electrical conductibility (for electroplating)as common metal particles.The binding force of interface between powder metallurgical or electroplated metal matrix and diamond particles can be strengthened and the quality of diamond tools can be greatly improved.

     

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