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熔渗法铜钨触头材料中的钨基体

TUNGSTEN MATRIX IN COPPER-TUNGSTEN COTACT MATERIALS BY IMPREGNATION PROCESS

  • 摘要: 探讨了钨粉粒度及组成、成形压力、烧结工艺、渗铜效果等因素对铜钨触头基体性能的影响。根据不同的粉末粒度选用不同的烧结工艺,可以获得不同含铜量所需孔隙度的钨基体。

     

    Abstract: Influences of particle size and constituent of tungsten powder, compacting pressure, sintering process, copper-infiltrating and other factors on the properties of copper-tungsten contact matrix were studied. Different sinteringtechnologies were choosed according to various particle sizes to obtain tungsten matrix with required porosity for corresponding copper contents.

     

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