高级检索

免清洗型软钎膏用锡基合金焊粉

徐柱天, 张少明, 李永伟, 李可平, 朱学新

徐柱天, 张少明, 李永伟, 李可平, 朱学新. 免清洗型软钎膏用锡基合金焊粉[J]. 粉末冶金技术, 1997, 15(2): 130-134.
引用本文: 徐柱天, 张少明, 李永伟, 李可平, 朱学新. 免清洗型软钎膏用锡基合金焊粉[J]. 粉末冶金技术, 1997, 15(2): 130-134.
Xu Zhutian, Zhang Shaoming, Li Yongwei, Li Keping, Zhu Xuexin. Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste[J]. Powder Metallurgy Technology, 1997, 15(2): 130-134.
Citation: Xu Zhutian, Zhang Shaoming, Li Yongwei, Li Keping, Zhu Xuexin. Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste[J]. Powder Metallurgy Technology, 1997, 15(2): 130-134.

免清洗型软钎膏用锡基合金焊粉

详细信息
    作者简介:

    徐柱天,高级工程师,主要从事金属材料的研究工作。

Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste

  • 摘要: 采用气体雾化法研制了SMT用免清洗型软钎膏的锡基合金焊粉,其合金成分及杂质元素含量达到美国QQ-S-571E和日本JIS-Z-3282A级标准,氧化物含量达到美国Multicore公司无氧焊粉的标准,一次出粉率平均达到70%以上。
    Abstract: Gas-atomizing process has been used for developing SMT-purposed raw material tin based alloy soldering powder of free-cleaning type soldering paste,the alloy composition and impurity component contents of which have reached US-QQ-SS-571E and JAP JIS-Z-3282A grade standards with oxide contents meeting the standard of US Multicore Co.'s oxygen free flux powder and with an average single powder production rate over 70%.
计量
  • 文章访问数:  196
  • HTML全文浏览量:  22
  • PDF下载量:  6
  • 被引次数: 0
出版历程
  • 收稿日期:  1997-01-27
  • 网络出版日期:  2021-07-20

目录

    /

    返回文章
    返回