免清洗型软钎膏用锡基合金焊粉

Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste

摘要: 采用气体雾化法研制了SMT用免清洗型软钎膏的锡基合金焊粉,其合金成分及杂质元素含量达到美国QQ-S-571E和日本JIS-Z-3282A级标准,氧化物含量达到美国Multicore公司无氧焊粉的标准,一次出粉率平均达到70%以上。

Abstract: Gas-atomizing process has been used for developing SMT-purposed raw material tin based alloy soldering powder of free-cleaning type soldering paste,the alloy composition and impurity component contents of which have reached US-QQ-SS-571E and JAP JIS-Z-3282A grade standards with oxide contents meeting the standard of US Multicore Co.'s oxygen free flux powder and with an average single powder production rate over 70%.