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Fabrication of high performance sintered materials through PIM
2005, 23(2): 83-87. DOI: 10.3321/j.issn:1001-3784.2005.02.001
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Ultrasonic fatigue property of metal injection molded cold work tool steel
2005, 23(2): 88-90. DOI: 10.3321/j.issn:1001-3784.2005.02.002
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Quality improvement of the micro metal injection molded products
2005, 23(2): 91-94. DOI: 10.3321/j.issn:1001-3784.2005.02.003
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Fatigue and impact strengths of austenitic stainless steel by powder injection molding
2005, 23(2): 95-99. DOI: 10.3321/j.issn:1001-3784.2005.02.004
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Effect of activated sintering on diamond enhanced tungsten carbide composite bits
Shi Xiaoliang, Shao Gangqin, Duan Longchen, Tang Fenglin, Yuan Runzhang
2005, 23(2): 100-103. DOI: 10.3321/j.issn:1001-3784.2005.02.005
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Effect of magnetic powder and coupling treatment on properties of rubber bonded rolled magnets
Wang Zewen, Fan Zhikang, Liang Shuhua, Xiao Peng
2005, 23(2): 104-107. DOI: 10.3321/j.issn:1001-3784.2005.02.006
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Study of novel 70%Si-Al alloy for electronic packaging prepared by the spray deposition technique
Tian Chong, Chen Guiyun, Yang Lin, Zhao Jiuzhou, Zhang Yongchang
2005, 23(2): 108-111. DOI: 10.3321/j.issn:1001-3784.2005.02.007
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Effect of presing processes on structure and magnetic properties of the bonded NdFeB magnet
Li Jun, Liu Ying, Gao Shengji, Tu Mingjing
2005, 23(2): 112-115. DOI: 10.3321/j.issn:1001-3784.2005.02.008
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Effect of milling process on properties of Ti/HA biomedical composites
Liu Fang, Zhou Kechao, Liu Yong
2005, 23(2): 116-119. DOI: 10.3321/j.issn:1001-3784.2005.02.009
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Hot pressing of Ni-Al2O3/Cu-Al2O3 cermet nanopowder
Fan Jinglian, Liu Jun, Huang Baiyun, Ling Guoliang, Liu Tao
2005, 23(2): 120-124. DOI: 10.3321/j.issn:1001-3784.2005.02.010
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The selection of deposition distance and withdrawal velocity in spray forming
Huo Guang, Deng Deguo, Xie Ming, Zheng Fuqian, Shi Qingnan
2005, 23(2): 125-128. DOI: 10.3321/j.issn:1001-3784.2005.02.011
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Research progress and prospect of the process in warm compaction in powder metallurgy
Yi Jianhong, Ye Tuming, Peng Yuandong
2005, 23(2): 140-144. DOI: 10.3321/j.issn:1001-3784.2005.02.014
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PM materials for electronic packaging
Wang Tiejun, Zhou Wuping, Xiong Ning, Liu Guohui
2005, 23(2): 145-151. DOI: 10.3321/j.issn:1001-3784.2005.02.015
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