Tian Chong, Chen Guiyun, Yang Lin, Zhao Jiuzhou, Zhang Yongchang. Study of novel 70%Si-Al alloy for electronic packaging prepared by the spray deposition technique[J]. Powder Metallurgy Technology, 2005, 23(2): 108-111. DOI: 10.3321/j.issn:1001-3784.2005.02.007
|
Citation:
|
Tian Chong, Chen Guiyun, Yang Lin, Zhao Jiuzhou, Zhang Yongchang. Study of novel 70%Si-Al alloy for electronic packaging prepared by the spray deposition technique[J]. Powder Metallurgy Technology, 2005, 23(2): 108-111. DOI: 10.3321/j.issn:1001-3784.2005.02.007
|
Tian Chong, Chen Guiyun, Yang Lin, Zhao Jiuzhou, Zhang Yongchang. Study of novel 70%Si-Al alloy for electronic packaging prepared by the spray deposition technique[J]. Powder Metallurgy Technology, 2005, 23(2): 108-111. DOI: 10.3321/j.issn:1001-3784.2005.02.007
|
Citation:
|
Tian Chong, Chen Guiyun, Yang Lin, Zhao Jiuzhou, Zhang Yongchang. Study of novel 70%Si-Al alloy for electronic packaging prepared by the spray deposition technique[J]. Powder Metallurgy Technology, 2005, 23(2): 108-111. DOI: 10.3321/j.issn:1001-3784.2005.02.007
|
DownLoad: