Wang Tiejun, Zhou Wuping, Xiong Ning, Liu Guohui. PM materials for electronic packaging[J]. Powder Metallurgy Technology, 2005, 23(2): 145-151. DOI: 10.3321/j.issn:1001-3784.2005.02.015
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Citation:
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Wang Tiejun, Zhou Wuping, Xiong Ning, Liu Guohui. PM materials for electronic packaging[J]. Powder Metallurgy Technology, 2005, 23(2): 145-151. DOI: 10.3321/j.issn:1001-3784.2005.02.015
|
Wang Tiejun, Zhou Wuping, Xiong Ning, Liu Guohui. PM materials for electronic packaging[J]. Powder Metallurgy Technology, 2005, 23(2): 145-151. DOI: 10.3321/j.issn:1001-3784.2005.02.015
|
Citation:
|
Wang Tiejun, Zhou Wuping, Xiong Ning, Liu Guohui. PM materials for electronic packaging[J]. Powder Metallurgy Technology, 2005, 23(2): 145-151. DOI: 10.3321/j.issn:1001-3784.2005.02.015
|
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