Liu Nan, Huang Yuanping, Liu Haiyan, Yang Guangyu, Jing Peng, Li Zhengfeng. High thermal-conductivity diamond/Cu composites fabricated by infiltration[J]. Powder Metallurgy Technology, 2014, 32(1): 59-63. DOI: 10.3969/j.issn.1001-3784.2014.01.011
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Citation:
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Liu Nan, Huang Yuanping, Liu Haiyan, Yang Guangyu, Jing Peng, Li Zhengfeng. High thermal-conductivity diamond/Cu composites fabricated by infiltration[J]. Powder Metallurgy Technology, 2014, 32(1): 59-63. DOI: 10.3969/j.issn.1001-3784.2014.01.011
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Liu Nan, Huang Yuanping, Liu Haiyan, Yang Guangyu, Jing Peng, Li Zhengfeng. High thermal-conductivity diamond/Cu composites fabricated by infiltration[J]. Powder Metallurgy Technology, 2014, 32(1): 59-63. DOI: 10.3969/j.issn.1001-3784.2014.01.011
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Citation:
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Liu Nan, Huang Yuanping, Liu Haiyan, Yang Guangyu, Jing Peng, Li Zhengfeng. High thermal-conductivity diamond/Cu composites fabricated by infiltration[J]. Powder Metallurgy Technology, 2014, 32(1): 59-63. DOI: 10.3969/j.issn.1001-3784.2014.01.011
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