Song Peng, Liu Guohui, Xiong Ning, Cui Honggang, Wang Guangda. Preparation and properties of CPC electronic packaging materials[J]. Powder Metallurgy Technology, 2016, 34(6): 403-406,427. DOI: 10.3969/j.issn.1001-3784.2016.06.001
|
Citation:
|
Song Peng, Liu Guohui, Xiong Ning, Cui Honggang, Wang Guangda. Preparation and properties of CPC electronic packaging materials[J]. Powder Metallurgy Technology, 2016, 34(6): 403-406,427. DOI: 10.3969/j.issn.1001-3784.2016.06.001
|
Song Peng, Liu Guohui, Xiong Ning, Cui Honggang, Wang Guangda. Preparation and properties of CPC electronic packaging materials[J]. Powder Metallurgy Technology, 2016, 34(6): 403-406,427. DOI: 10.3969/j.issn.1001-3784.2016.06.001
|
Citation:
|
Song Peng, Liu Guohui, Xiong Ning, Cui Honggang, Wang Guangda. Preparation and properties of CPC electronic packaging materials[J]. Powder Metallurgy Technology, 2016, 34(6): 403-406,427. DOI: 10.3969/j.issn.1001-3784.2016.06.001
|
DownLoad: