TUNGSTEN MATRIX IN COPPER-TUNGSTEN COTACT MATERIALS BY IMPREGNATION PROCESS

Yin Weihong; Teng Xiuren

Yin Weihong, Teng Xiuren. TUNGSTEN MATRIX IN COPPER-TUNGSTEN COTACT MATERIALS BY IMPREGNATION PROCESS[J]. Powder Metallurgy Technology, 1988, 6(3): 154-158.

Citation:

Yin Weihong, Teng Xiuren. TUNGSTEN MATRIX IN COPPER-TUNGSTEN COTACT MATERIALS BY IMPREGNATION PROCESS[J]. Powder Metallurgy Technology, 1988, 6(3): 154-158.

Citation:

Yin Weihong, Teng Xiuren. TUNGSTEN MATRIX IN COPPER-TUNGSTEN COTACT MATERIALS BY IMPREGNATION PROCESS[J]. Powder Metallurgy Technology, 1988, 6(3): 154-158.

TUNGSTEN MATRIX IN COPPER-TUNGSTEN COTACT MATERIALS BY IMPREGNATION PROCESS

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Influences of particle size and constituent of tungsten powder, compacting pressure, sintering process, copper-infiltrating and other factors on the properties of copper-tungsten contact matrix were studied. Different sinteringtechnologies were choosed according to various particle sizes to obtain tungsten matrix with required porosity for corresponding copper contents.

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TUNGSTEN MATRIX IN COPPER-TUNGSTEN COTACT MATERIALS BY IMPREGNATION PROCESS

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