Xu Zhutian, Zhang Shaoming, Li Yongwei, Li Keping, Zhu Xuexin. Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste[J]. Powder Metallurgy Technology, 1997, 15(2): 130-134.
Citation:
Xu Zhutian, Zhang Shaoming, Li Yongwei, Li Keping, Zhu Xuexin. Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste[J]. Powder Metallurgy Technology, 1997, 15(2): 130-134.
Xu Zhutian, Zhang Shaoming, Li Yongwei, Li Keping, Zhu Xuexin. Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste[J]. Powder Metallurgy Technology, 1997, 15(2): 130-134.
Citation:
Xu Zhutian, Zhang Shaoming, Li Yongwei, Li Keping, Zhu Xuexin. Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste[J]. Powder Metallurgy Technology, 1997, 15(2): 130-134.
Tin Based Alloy Solder Powder for Free-Cleaning Type Soldering Paste
Gas-atomizing process has been used for developing SMT-purposed raw material tin based alloy soldering powder of free-cleaning type soldering paste,the alloy composition and impurity component contents of which have reached US-QQ-SS-571E and JAP JIS-Z-3282A grade standards with oxide contents meeting the standard of US Multicore Co.'s oxygen free flux powder and with an average single powder production rate over 70%.
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