Shu Dayu, Zhao Zude, Huang Jihua, Zhang Hua, Wan Yun, Jia Daijin, Zhang Longping. Effects of Ti on the microstructure and mechanical properties of reactive diffusion bonded SiCp/2618A1 composite joints by using the Al-Ag-Cu interlayers[J]. Powder Metallurgy Technology, 2008, (2): 106-110.
Citation:
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Shu Dayu, Zhao Zude, Huang Jihua, Zhang Hua, Wan Yun, Jia Daijin, Zhang Longping. Effects of Ti on the microstructure and mechanical properties of reactive diffusion bonded SiCp/2618A1 composite joints by using the Al-Ag-Cu interlayers[J]. Powder Metallurgy Technology, 2008, (2): 106-110.
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Shu Dayu, Zhao Zude, Huang Jihua, Zhang Hua, Wan Yun, Jia Daijin, Zhang Longping. Effects of Ti on the microstructure and mechanical properties of reactive diffusion bonded SiCp/2618A1 composite joints by using the Al-Ag-Cu interlayers[J]. Powder Metallurgy Technology, 2008, (2): 106-110.
Citation:
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Shu Dayu, Zhao Zude, Huang Jihua, Zhang Hua, Wan Yun, Jia Daijin, Zhang Longping. Effects of Ti on the microstructure and mechanical properties of reactive diffusion bonded SiCp/2618A1 composite joints by using the Al-Ag-Cu interlayers[J]. Powder Metallurgy Technology, 2008, (2): 106-110.
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