Han Shengli, Song Yueqing, Cui Shun, Xia Yang. The investigation on a new kind of Mo-Cu alloy material for electronic sealing material[J]. Powder Metallurgy Technology, 2009, 27(3): 189-192.
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Citation:
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Han Shengli, Song Yueqing, Cui Shun, Xia Yang. The investigation on a new kind of Mo-Cu alloy material for electronic sealing material[J]. Powder Metallurgy Technology, 2009, 27(3): 189-192.
|
Han Shengli, Song Yueqing, Cui Shun, Xia Yang. The investigation on a new kind of Mo-Cu alloy material for electronic sealing material[J]. Powder Metallurgy Technology, 2009, 27(3): 189-192.
|
Citation:
|
Han Shengli, Song Yueqing, Cui Shun, Xia Yang. The investigation on a new kind of Mo-Cu alloy material for electronic sealing material[J]. Powder Metallurgy Technology, 2009, 27(3): 189-192.
|
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