Xu Tianhan, Wang Danghui, Yao Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Powder Metallurgy Technology, 2010, 28(2): 115-119,124.
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Citation:
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Xu Tianhan, Wang Danghui, Yao Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Powder Metallurgy Technology, 2010, 28(2): 115-119,124.
|
Xu Tianhan, Wang Danghui, Yao Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Powder Metallurgy Technology, 2010, 28(2): 115-119,124.
|
Citation:
|
Xu Tianhan, Wang Danghui, Yao Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Powder Metallurgy Technology, 2010, 28(2): 115-119,124.
|
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