Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology

Xu Tianhan; Wang Danghui; Yao Tingzhen

PDF
Cite
Share

facebook

twitter

google

linkedin

Turn off MathJax

Article Contents

Powder Metallurgy Technology > 2010 > 28(2): 115-119,124.

Xu Tianhan, Wang Danghui, Yao Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Powder Metallurgy Technology, 2010, 28(2): 115-119,124.

Citation:

Xu Tianhan, Wang Danghui, Yao Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Powder Metallurgy Technology, 2010, 28(2): 115-119,124.

Citation:

Xu Tianhan, Wang Danghui, Yao Tingzhen. Study on the preparation of Sn-Ag-Cu lead-free solder powder in surface packaging technology[J]. Powder Metallurgy Technology, 2010, 28(2): 115-119,124.

PDF (421 KB)