Chen Hui, Jia Chengchang, Chu Ke, Liang Xuebing, Liu Zhaofang, Guo Hong. Research on increasing thermal conductivity of diamond/copper composites by improving the interface condition[J]. Powder Metallurgy Technology, 2010, 28(2): 143-149.
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Citation:
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Chen Hui, Jia Chengchang, Chu Ke, Liang Xuebing, Liu Zhaofang, Guo Hong. Research on increasing thermal conductivity of diamond/copper composites by improving the interface condition[J]. Powder Metallurgy Technology, 2010, 28(2): 143-149.
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Chen Hui, Jia Chengchang, Chu Ke, Liang Xuebing, Liu Zhaofang, Guo Hong. Research on increasing thermal conductivity of diamond/copper composites by improving the interface condition[J]. Powder Metallurgy Technology, 2010, 28(2): 143-149.
|
Citation:
|
Chen Hui, Jia Chengchang, Chu Ke, Liang Xuebing, Liu Zhaofang, Guo Hong. Research on increasing thermal conductivity of diamond/copper composites by improving the interface condition[J]. Powder Metallurgy Technology, 2010, 28(2): 143-149.
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