SiC<sub>p</sub>/Cu复合材料的研究进展

曾昭锋; 周波涛; 熊宣雯; 李翔; 李著龙; 王国强

doi:10.19591/j.cnki.cn11-1974/tf.2020080015

SiC_p/Cu复合材料的研究进展

doi: 10.19591/j.cnki.cn11-1974/tf.2020080015

曾昭锋^{1, 2, ,},
周波涛¹,
熊宣雯¹,
李翔¹,
李著龙¹,
王国强¹

1.
汉江师范学院物理与电子工程学院，十堰 442000
2.
汉江师范学院新型功能材料制备与物性研究中心，十堰 442000

基金项目: 2019年国家级大学生创新创业训练项目（201910518012）；湖北省教育厅科研计划资助项目（D20203101）；湖北省自然科技基金资助项目（2019CFB777）

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Email：524760608@qq.com

中图分类号: TB331
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出版历程
- 收稿日期: 2020-08-24
- 刊出日期: 2021-04-27

Research progress of SiC_p/Cu composites

1.
School of Physics and Electronic Engineering, Hanjiang Normal University, Shiyan 442000, China
2.
Center for Research on the Preparation and Properties of New Function Materials, Hanjiang Normal University, Shiyan 442000, China

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Corresponding author: Email: 524760608@qq.com

摘要

摘要: SiC_p/Cu颗粒增强铜基复合材料是目前金属陶瓷复合材料的研究热点。本文简述了SiC_p/Cu颗粒增强复合材料的制备方法及优缺点，分析了影响SiC_p/Cu颗粒增强复合材料性能的主要因素，包括SiC_p颗粒含量、SiC_p颗粒尺寸及烧结工艺等方面，提出了SiC_p/Cu颗粒增强复合材料存在的问题，总结了制备方法及工艺的选择原则，并对其发展方向进行了展望。
- 铜基复合材料 /
- 颗粒增强 /
- 研究进展 /
- 性能
Abstract: SiC_p/Cu particle-reinforced Cu-matrix composites are the current hotspots of the metal-ceramic composites. The main preparation methods of the SiC_p/Cu particle-reinforced composites were introduced in this paper and the advantages and disadvantages were compared. The main factors which affected the performance of the SiC_p/Cu particle-reinforced composites were analyzed, including the content of SiC_p particles, the size of SiC_p particles, and the sintering process. The existing problems of the SiC_p/Cu particle-reinforced composite materials were proposed. The selection principles of the preparation methods and processes were summarized, and the development direction was prospected.
- copper matrix composites /
- particle reinforcement /
- research progress /
- properties

HTML全文

图 1 1000 ℃下SiC_p预氧化时间对SiC_p/Cu复合材料热导率的影响

Figure 1. Effect of the preoxidation time of SiC_p on the thermal conductivity of the SiC_p/Cu composites at 1000 ℃

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图 2 SiC_p体积分数对SiC_p/Cu复合材料磨损率的影响

Figure 2. Effect of SiC_p volume fraction on the wear rate of SiC_p/Cu composites

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图 3 不同温度下SiC_p颗粒尺寸对膨胀系数的影响

Figure 3. Effect of SiC_p particle size on expansion coefficient at different temperatures

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图 4 不同烧结温度的W‒SiC_p/Cu复合材料相对密度

Figure 4. Relative density of the W‒SiC_p/Cu composites at different sintering temperatures

下载: 全尺寸图片幻灯片

参考文献(41)

[1]	Celebi E G, Ipek M, Zeytin S, et al. An investigation of the effect of SiC particle size on CuüSiC composites. Composites Part B, 2012, 43(4): 1813 doi: 10.1016/j.compositesb.2012.01.006
[2]	Zhang L, Qu X H, He X B, et al. Thermo-physical and mechanical properties of high volume fraction SiC_p/Cu composites prepared by pressureless infiltration. Mater Sci Eng A, 2008, 489(1-2): 285 doi: 10.1016/j.msea.2007.12.028
[3]	Gan K K, Gu M Y. Mechanical alloying process and mechanical properties of Cu‒SiC_p composite. Mater Sci Technol, 2006, 22(8): 960 doi: 10.1179/174328406X102363
[4]	Wang L D, Xue Z W, Qiao Y J, et al. Anisotropic thermal expansion behaviors of copper matrix in β-eucryptite/copper composite. Mater Sci Eng B, 2012, 177(11): 873 doi: 10.1016/j.mseb.2012.03.036
[5]	Celebi E G, Yener T, Altinsoy I, et al. The effect of sintering temperature on some properties of Cu‒SiC composite. J Alloys Compd, 2011, 509(20): 6036 doi: 10.1016/j.jallcom.2011.02.170
[6]	Wang D B, Wu Y C, Wang W F, et al. Research on tensile properties and fracture mechanism of different sizes SiC_p reinforced Cu matrix composites. J Funct Mater, 2008, 39(3): 426 王德宝, 吴玉程, 王文芳, 等. 不同粒度SiC_p增强铜基复合材料拉伸性能及断裂机制的研究. 功能材料, 2008, 39(3): 426
[7]	Zou G Z, Cao M S, Lin H B, et al. Nickel layer deposition on SiC nanoparticles by simple electroless plating and its dielectric behaviors. Powder Technol, 2006, 168(2): 84 doi: 10.1016/j.powtec.2006.07.002
[8]	Hong S, Lee H, Lee J, et al. Highly stretchable and transparent metal nanowire heater for wearable electronics applications. Adv Mater, 2015, 27(32): 4744 doi: 10.1002/adma.201500917
[9]	Akramifard H R, Shamanian M, Sabbaghian M, et al. Microstructure and mechanical properties of Cu/SiC metal matrix composite fabricated via friction stir processing. Mater Des, 2014, 54(2): 838
[10]	Yih P, Chung D D L. Silicon carbide whisker copper-matrix composites fabricated by hot pressing copper coated whiskers. J Mater Sci, 1996, 31: 399 doi: 10.1007/BF01139157
[11]	Yih P, Chung D D L. A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal-matrix composites. J Mater Sci, 1997, 32(11): 2873 doi: 10.1023/A:1018624517297
[12]	Wang H L, Zhang R, Qiao Z Y. Study on fabrication of SiC/Cu composite powder by chemical plating. Foshan Ceram, 2003(11): 14 doi: 10.3969/j.issn.1006-8236.2003.11.005 王海龙, 张锐, 乔祝云. 化学镀法制备SiC/Cu金属陶瓷复合粉体工艺的研究. 佛山陶瓷, 2003(11): 14 doi: 10.3969/j.issn.1006-8236.2003.11.005
[13]	Liu M, Bai S X, Li S, et al. Effect of interfacial modifying on thermo-physical properties of SiC_p/Cu composites. J Mater Eng, 2016, 44(8): 11 doi: 10.11868/j.issn.1001-4381.2016.08.002 刘猛, 白书欣, 李顺, 等. 界面改性对SiCp/Cu复合材料热物理性能的影响. 材料工程, 2016, 44(8): 11 doi: 10.11868/j.issn.1001-4381.2016.08.002
[14]	Narciso J, Weber L, Molina J M, et al. Reactivity and thermal behaviour of Cu‒Si/SiC composites: effects of SiC oxidation. Mater Sci Technol, 2006, 22(12): 1464 doi: 10.1179/174328406X131000
[15]	Hu C X. Study on Properties of SiC/Cu Composite Prepared by Spark Plasma Sintering [Dissertation]. Shanghai: East China University of Science and Technology, 2013 胡翠欣. 放电等离子法制备SiC/Cu复合材料及其性能研究[学位论文]. 上海: 华东理工大学, 2013
[16]	Gu W L, Lü W W. Preparation of SiC_p/Cu nanocomposite, application of nano materials in traditional industries // Proceedings of China Society for Materials Research. Yantai, 2005: 479 谷万里, 吕卫卫. SiC_p/Cu纳米复合材料的制备, 纳米材料在传统产业中的应用//中国材料研究学会会议论文集. 烟台, 2005: 479
[17]	Akbarpour M R, Salahi E, Alikhani H F, et al. Microstructure and compressibility of SiC nanoparticles reinforced Cu nanocomposite powders processed by high energy mechanical milling. Ceram Int, 2014, 40(1): 951 doi: 10.1016/j.ceramint.2013.06.091
[18]	Zhang L, Qu X H, Duan B H, et al. Study on microstructure and properties of SiC_p/Cu composites fabricated by spark plasma sintering. Chin J Rare Met, 2008, 32(5): 614 doi: 10.3969/j.issn.0258-7076.2008.05.015 章林, 曲选辉, 段柏华, 等. SiC_p/Cu复合材料的SPS烧结及组织性能. 稀有金属, 2008, 32(5): 614 doi: 10.3969/j.issn.0258-7076.2008.05.015
[19]	Hu C X, Zhang X Q, Lü Y T, et al. Study on properties of SiC/Cu composite prepared by spark plasma sintering. Hot Working Technol, 2013, 42(6): 117 胡翠欣, 张修庆, 吕玉廷, 等. 放电等离子法制备SiC/Cu复合材料及其性能研究. 热加工工艺, 2013, 42(6): 117
[20]	Barmouz M, Givi M K B. Fabrication of in situ Cu/SiC composites using multi-pass friction stir processing: Evaluation of microstructural, porosity, mechanical and electrical behavior. Composites Part A, 2011, 42(10): 1445 doi: 10.1016/j.compositesa.2011.06.010
[21]	Pan C G, Wu Z, Ding Z Z, et al. Microstructure and wear properties of Cu-coated SiC_p/Ni35 coating by laser cladding. Surf Technol, 2017, 46(12): 110 潘成刚, 吴竹, 丁紫正, 等. 激光熔覆Cu包SiC_p/Ni35覆层组织及磨损性能. 表面技术, 2017, 46(12): 110
[22]	Fan B B, Guan L, Li K, et al. Influence of SiC content on the mechnical properties of SiC/Cu composites. Bull Chin Ceram Soc, 2009, 29(Suppl 1): 114 范冰冰, 关莉, 李凯, 等. SiC组分含量对SiC/Cu复合材料力学性能的影响. 硅酸盐通报, 2009, 29(增刊 1): 114
[23]	Hou B F, Qu X H, He X B, et al. Effect of SiC content on wear properties of SiC_p/Cu composite fabricated by injection molding. Mater Mech Eng, 2012, 34(12): 67 侯宝峰, 曲选辉, 何新波, 等. SiC含量对注射成形SiC_p/Cu复合材料磨损性能的影响. 机械工程材料, 2012, 34(12): 67
[24]	Liu Y J, Zhang Y L, Gao J, et al. Effect of SiC particle size on thermal expansion coefficients of SiC_p/Cu composites. Ordn Mater Sci Eng, 2013, 36(1): 118 doi: 10.3969/j.issn.1004-244X.2013.01.036 刘有金, 张云龙, 高晶, 等. SiC颗粒尺寸对SiC_p/Cu基复合材料热膨胀数的影响. 兵器材料科学与工程, 2013, 36(1): 118 doi: 10.3969/j.issn.1004-244X.2013.01.036
[25]	Zhang J, Xu X J, Chen K M, et al. Effect of SiC_p size on wear-resistance of SiC_p/Cu matrix composite. Tribology, 2003, 23(4): 301 doi: 10.3321/j.issn:1004-0595.2003.04.009 张洁, 许晓静, 陈康敏, 等. SiC_p尺寸对SiC_p/Cu基复合材料抗磨性能的影响. 摩擦学学报, 2003, 23(4): 301 doi: 10.3321/j.issn:1004-0595.2003.04.009
[26]	Zhu D Z. Microstructure and Properties Investigation of SiC_p/Cu Composites [Dissertation]. Harbin: Harbin University of Science and Technology, 2005 朱德智. SiC_p/Cu复合材料组织与性能研究[学位论文]. 哈尔滨: 哈尔滨理工大学, 2005
[27]	Wang C C. Microstructure and Properties of SiC_p/Cu Composites for Electronic Packaging [Dissertation]. Jinan: Shandong University, 2007 王常春. 电子封装用SiC_p/Cu复合材料的微观组织与性能研究[学位论文]. 济南: 山东大学, 2007
[28]	Wang H L, Zhang R, Liu S B, et al. Effects of sintering process on mechanical properties and fracture behavior of SiC/Cu‒Al composites. J Chin Ceram Soc, 2006, 34(11): 1315 doi: 10.3321/j.issn:0454-5648.2006.11.005 王海龙, 张锐, 刘锁兵, 等. 烧结工艺对SiC/Cu‒Al复合材料的力学性能及断裂行为的影响. 硅酸盐学报, 2006, 34(11): 1315 doi: 10.3321/j.issn:0454-5648.2006.11.005
[29]	Liu H. Fabrication and Properties of W‒SiC_p/Cu Composites by Hot Pressing Sintering [Dissertation]. Wuhan: Wuhan University of Technology, 2014 刘凰. W‒SiC_p/Cu复合材料的热压烧结制备及其性能研究[学位论文]. 武汉: 武汉理工大学, 2014
[30]	Tang L L, Shan L, Ding P L, et al. Study on fabrication and properties of high volume fraction β-SiC_P/Cu composite. Hot Working Technol, 2015, 44(8): 118 唐丽丽, 单琳, 丁佩岭, 等. 高体积分数β-SiC_p/Cu复合材料的制备及性能研究. 热加工工艺, 2015, 44(8): 118
[31]	Sun B, Yang S, Xie B, et al. Preparation of SiC/Cu composites with an amorphous grain boundary. J Chin Ceram Soc, 2019, 47(1): 98 孙冰, 杨硕, 谢斌, 等. 非晶相界面SiC/Cu复合材料的制备. 硅酸盐学报, 2019, 47(1): 98
[32]	Sundberg G, Paul P, Sung C, et al. Fabrication of Cu/SiC metal matrix composites. J Mater Sci, 2006, 41(2): 485 doi: 10.1007/s10853-005-2622-3
[33]	Marín J, Olivares L, Ordoñez S, et al. Wetting of silicon carbide by Cu‒Si alloys. Mater Sci Forum, 2003, 416(4): 487
[34]	Rado C, Drevet B, Eustathopoulos N. The role of compound formation in reactive wetting: the Cu/SiC system. Acta Mater, 2000, 48(18-19): 4483 doi: 10.1016/S1359-6454(00)00235-4
[35]	Shimbo M, Naka M, Okamoto I. Wettability of silicon carbide by aluminium, copper and silver. J Mater Sci Lett, 1989, 8(6): 663 doi: 10.1007/BF01730435
[36]	An Z, Ohi A, Hirai M, et al. Study of the reaction at Cu/3C‒SiC interface. Surf Sci, 2001, 493(1-3): 182 doi: 10.1016/S0039-6028(01)01211-0
[37]	Schubert T, Brendel A, Schmid K. Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications. Composites Part A, 2007, 38(12): 2398 doi: 10.1016/j.compositesa.2007.08.012
[38]	Gan K K, Gu M Y, Mu G H. Effect of Fe on the properties of Cu/SiC_p composite. J Mater Sci, 2008, 43: 1318 doi: 10.1007/s10853-007-2294-2
[39]	Zhou Y X, Xu F, Lü Z L, et al. Friction and wear properties of Cu matrix composites hybrid reinforced with SiC and graphite particles. Mater Mech Eng, 2015, 39(2): 90 周永欣, 徐飞, 吕振林, 等. SiC和石墨颗粒混杂增强铜基复合材料的摩擦磨损性能. 机械工程材料, 2015, 39(2): 90
[40]	Dai Q F. Investigation on Interfacial Glass Phase Modification and Properties of SiC/Cu Composites [Dissertation]. Zhengzhou: Zhengzhou University, 2018 代巧飞. SiC/Cu复合材料界面玻璃相修饰及性能研究[学位论文]. 郑州: 郑州大学, 2018
[41]	Chen L C. Review of preparation and optoelectronic characteristics of Cu₂O-based solar cells with nanostructure. Mater Sci Semicond Process, 2013, 16(5): 1172 doi: 10.1016/j.mssp.2012.12.028