Abstract: With the increasing power of the electronic device chip, the higher requirements are put forward for the thermophysical properties of the heat dissipation materials. The metal matrix composites as the ideal heat dissipation material, which are composed of the high thermal conductivity and low thermal expansion reinforcement phase and the high thermal conductivity metal, show the high thermal conductivity and the adjustable coefficient of thermal expansion. The research progress of the copper matrix and aluminum matrix composites reinforced by Si, SiC_p, diamond, and flake graphite in recent years was summarized in this paper, and the existing problems and future research direction of the metal matrix composites were prospected.