Research progress on C-coated Ti composite powders used for preparing high-performance Ti matrix composites
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摘要: 钛基复合材料中增强相的形貌和分布是决定材料性能的关键，常规粉体机械混合后烧结引入增强相的方式存在形貌难调控、分布单一且均匀性差等问题，导致其强化效果不佳。针对该问题，本团队开发了一系列碳包覆钛复合粉体，通过设计包覆碳源的结构与组成调控粉体烧结过程中增强相的形成路径，不仅实现了增强相形貌调控和不同形貌的组合搭配，而且得到了晶内和晶界双增强相组织，大幅提升了钛基复合材料的力学性能。在此基础上，将碳包覆钛复合粉体拓展应用至钛基复合材料的3D打印领域，解决了高品质复合粉体缺乏并制约其发展的瓶颈问题。总结并评述了碳包覆钛复合粉体在制备钛基复合材料中取得的研究结果与工作进展，为增强相设计与调控提供新的研究思路及技术路线。Abstract: The morphology and distribution of reinforcements in the titanium matrix composites (TMCs) are crucial in determining the material performances. Due to the uncontrollable morphology and inhomogeneous distribution of the reinforcements in the current TMCs, a series of C-coated Ti composite powders were developed by fluidization technology. By designing the structure and composition of C-coatings, the different morphology combinations and the intragranular/interface reinforcements were both achieved, which significantly improved the mechanical properties of TMCs. Furthermore, the composite powders were also extended to the 3D printing of TMCs, which solved the bottleneck issue of lacking the high-quality composite powders. The research results and work progress of the C-coated Ti composite powders in the preparation of high-performance TMCs were summarized and reviewed, providing the new insight and technical route for the design and control of reinforcements in TMCs.
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Key words:
- titanium matrix composites /
- powder metallurgy /
- reinforcement /
- strengthening mechanism
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图 1 不同类型碳包覆钛复合粉体的制备方法示意图
Figure 1. Schematic diagram of the fabrication process for the different C-coated Ti powders
图 2 不同碳包覆钛粉体显微形貌[29‒32]：（a）A–C/TC4粉的表面微观形貌；（b）A–C/TC4粉的截面微观形貌；（c）CNTs/Ti粉的微观形貌；（d）CNTs的透射电镜图片；（e）H–C/TC4粉的微观形貌；（f）两种碳源的透射电镜图片
Figure 2. Morphologies of the different C-coated Ti powders[29‒32]: (a) SEM image of the A–C/TC4 powder surface; (b) sectional SEM image of the A–C/TC4 powder; (c) SEM image of CNTs/Ti powder; (d) TEM image of the extracted CNTs; (e) SEM image of H–C/TC4 powder; (f) TEM image of the extracted CNTs and A–C
图 3 A‒C/TC4粉的热压烧结组织及增强相[29]：（a）和（b）A–C/TC4粉体的烧结组织和增强相分布的扫描电镜照片；（c）和（d）α-Ti晶内分布纳米片状增强相的形貌及物相分析；（e）和（f）β-Ti晶内分布颗粒增强相的形貌及物相分析
Figure 3. Sintered A–C/TC4 samples and the reinforcements[29]: (a) and (b) SEM images of the sintered A–C/TC4 samples and the reinforcement distribution; (c) and (d) the morphology and phase analysis of the nanoplatelets inside α-Ti grains; (e) and (f) the morphology and phase analysis of the nanoparticles inside β-Ti grains
图 4 CNTs/Ti粉在不同温度的烧结组织和增强相形貌分布[31]：（a）和（b）900 ℃；（c）和（d）1000 ℃；（e）和（f）900 ℃烧结样品中保留的CNTs和形成的TiC颗粒
Figure 4. Microstructure of the CNTs/Ti powder samples sintered at different temperatures[31]: (a) and (b) 900 ℃; (c) and (d) 1000 ℃; (e) and (f) TEM images of the remained CNTs and the formed TiC nanoparticles in the CNTs/Ti powder samples sintered at 900 ℃
图 6 CNTs/TC4粉体的热压烧结组织
Figure 6. Microstructures of the samples fabricated from the CNTs/TC4 powders by hot press sintering
图 7 H‒C/TC4粉体烧结组织及增强相[32]：（a）和（b）H–C/TC4粉体烧结组织及增强相分布；（c）～（e）晶界增强相的透射电子显微镜照片；（f）晶内增强相的透射电子显微镜照片
Figure 7. Sintered H–C/TC4 samples and the reinforcements[32]: (a) and (b) sintered H–C/TC4 sample microstructures and the reinforcement distribution; (c)～(e) TEM images of the interfacial reinforcements; (f) TEM images of the intragranular reinforcements
图 8 不同形貌和分布组合增强相强化钛基复合材料[29‒32]：（a）与文献报道中钛基复合材料压缩屈服强度对比；（b）晶界增强相的强化机制；（c）晶内增强相的强化机制；（d）晶内/晶界双增强相组织的强化机制示意图
Figure 8. Reinforcements with the different morphologies and distribution combinations in TMCs[29‒32]: (a) comparison of the TMCs compressive yield strength reported in literatures; (b) strengthening mechanisms of the interfacial reinforcements; (c) strengthening mechanisms of the intragranular reinforcements; (d) strengthening mechanism of the interfacial/intragranular double reinforced phase
图 9 CNTs/GA–TC4粉体的扫描电镜形貌（a）、原位合成CNTs扫描电镜形貌（b）、复合粉体打印样品宏观形貌（c）及打印样品的三维重构照片（d）[47]
Figure 9. SEM image of the CNTs/GA–TC4 powders (a), SEM image of the in situ synthesized CNTs (b), macro-profile of the samples printed by the CNTs/GA–TC4 powders (c), and 3D reconstructed images of the printed sample (d)[48]
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