Preparation of ultrafine Cu-20W composite powder by sol-gel with hydrogen reduction technology and its sintering behavior
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摘要: 本文以偏钨酸铵和硝酸铜为原料，采用溶胶-凝胶法结合氢还原制备了Cu-20wt.%W(Cu-20W)超细粉末，经压制烧结获得Cu-20W复合材料。对粉体的形貌和粒度进行表征，并考察烧结温度对Cu-20W烧结体试样组织和性能的影响。结果表明：通过溶胶-凝胶法结合氢还原可制备出平均粒度小于100 nm的Cu-20W复合粉末；随烧结温度的升高，Cu-20W烧结体试样的物理力学性能提高。1080 ℃烧结所得试样的致密度达97.20 %，电导率(IACS)、热导率、显微硬度和抗拉分别达到91.73 %、351.52 W·m-1·K-1、96.1 HV和431.03 MPa；在100 ℃到400 ℃的温度范围内，Cu-20W试样的CTE值在14.871×10-6·K-1~17.422×10-6·K-1之间。
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Abstract: In this paper, Cu-20wt.% (Cu-20W) ultrafine composite powders were prepared by a combination of sol-gel with hydrogen reduction method using ammonium metatungstate and copper nitrate as raw materials, and Cu-20W samples were obtained by pressing and sintering. The morphology and particle size of the powders were characterized and the effect of temperatures on the structure and properties of the Cu-20W samples were investigated. The results show that the Cu-20W composite powders with an average particle size of less than 100 nm by a combination of sol-gel with hydrogen reduction method; with the increase of sintering temperature, the physical and mechanical properties of Cu-20W samples are improved. The relative density of the samples sintered at 1080 °C is 97.20 %, the electrical conductivity (IACS), thermal conductivity, Vickers hardness and tensile strength are respectively reached 91.73 %, 351.52 W·m-1·K-1, 96.1 HV and 431.03 MPa; the CTE values of the Cu-20W samples ranged from 14.871×10-6·K-1 and 17.422×10-6·K-1 in the temperature range of 100 ℃ to 400 ℃. -
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