Abstract: The main characteristies and technical requirements on the application of thin diamond blades widely used in electronic industries for cutting base sheet wafer in semiconductors are presented in this paper. The base meterials and key procedures for producing copper alloy based diamond thin blades by powder metallurgy are summarized. The copper alloy based iamond thin blades were proved to be satisfactorily met the technical requirements by measuring the parameters of the blades and anayzing the results of cutting tests.