退火工艺对CuPb10Sn10轴瓦材料金相的影响

彭林; 李佳

doi:10.19591/j.cnki.cn11-1974/tf.2018.02.010

退火工艺对CuPb10Sn10轴瓦材料金相的影响

doi: 10.19591/j.cnki.cn11-1974/tf.2018.02.010

彭林^,,
李佳

湖南飞碟新材料有限责任公司, 长沙 410007

详细信息

通讯作者:
彭林, E-mail:286954197@qq.com

中图分类号: TF124
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- 被引次数: 0
出版历程
- 收稿日期: 2017-10-28
- 刊出日期: 2018-04-27

Influence of annealing process on the metallography of CuPb10Sn10 bearing material

PENG Lin^,,
LI Jia

Hunan Flydisc New Material Co., Ltd., Chashang 410007, China

More Information

Corresponding author: PENG Lin, E-mail:286954197@qq.com

摘要

摘要: 在CuPb10Sn10轴瓦材料中, 铅相的分布对材料的使用性能有较大影响。本文研究了退火温度、退火时间、退火气氛等退火工艺对CuPb10Sn10轴瓦材料金相组织的影响。结果表明, 当退火温度为810℃, 退火时间为20~25 min, 以及N₂/H₂=2 (体积比)时可以获得较高金相等级的CuPb10Sn10轴瓦材料。
- CuPb10Sn10 /
- 轴瓦材料 /
- 退火工艺 /
- 金相组织
Abstract: The distribution of Pb phase has a great influence on the performance of Cu Pb10 Sn10 bearing materials. In this paper, the effects of annealing temperature, time, and atmosphere on the metallography of bearing materials were studied. The results show that, the excellent metallographic Cu Pb10 Sn10 bearing materials can be prepared when the annealing temperature is 810 ℃, the annealing time is controlled as 20~25 min, and the volume ratio of N₂/H₂ is 2.
- CuPb10Sn10 /
- bearing materials /
- annealing technology /
- metallographic microstructure

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图 1 未退火CuPb10Sn10轴瓦材料金相组织(×100)

Figure 1. Metallography of CuPb10Sn10 bearing materials without annealing (×100)

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图 2 不同退火温度条件下CuPb10Sn10轴瓦材料的金相图(×100) : (a) 790℃; (b) 800℃; (c) 810℃; (d) 820℃

Figure 2. Metallography of CuPb10Sn10 bearing materials at different annealing temperature (×100) : (a) 790℃; (b) 800℃; (c) 810℃; (d) 820℃

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图 3 不同退火时间条件下CuPb10Sn10轴瓦材料的金相图(×100) : (a) 15 min; (b) 20 min; (c) 25 min; (d) 30 min

Figure 3. Metallography of CuPb10Sn10 bearing materials with different annealing time (×100) : (a) 15 min; (b) 20 min; (c) 25 min; (d) 30 min

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图 4 不同退火气氛N₂/H₂ (体积比)条件下CuPb10Sn10轴瓦材料的金相图(×100) : (a) 1; (b) 2; (c) 3

Figure 4. Metallography of CuPb10Sn10bearing materials in different N₂/H₂volume ratio (×100) : (a) 1; (b) 2; (c) 3

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表 1 实验原料化学成分(质量分数)

Table 1. Chemical composition of experimental materials %

Cu Pb Sn 杂质

79.53 9.61 9.59 1.27

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