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摘要: 以Al（H2PO4）3溶液为磷酸盐胶黏剂基体，研究了MgO、Al2O3、CuO三种固化剂对胶黏剂固化速率、固化温度、固化气密性的影响，分析了高温煅烧前后MgO和CuO对胶黏剂性能的影响。结果表明：MgO活性大，与Al（H2PO4）3基体反应迅速，不适合用作固化剂；以Al2O3为固化剂的胶黏剂密封性能差，Al2O3也不适合用作固化剂；未煅烧CuO作为磷酸盐胶黏剂的固化剂，反应速率适中且密封性能良好，当Al（H2PO4）3基体与CuO质量比为5.0：4.5时，气密性最好，为0.15 MPa（非上限）。Abstract: Al(H2PO4)3 solution was used as the matrix of phosphate adhesive, the effects of curing agents (MgO, Al2O3, and CuO) on the curing rate, curing temperature, and curing airtightness of adhesive were studied, and the influence of MgO and CuO before and after high temperature curing on the adhesive performance was also discussed. The results show that, MgO is not suitable as the curing agent due to the high activity, resulting in the rapid reaction with Al(H2PO4)3 matrix; Al2O3 is also not suitable used as the curing agent because of the low airtightness. Uncalcined CuO as curing agent shows the advantages of moderate reaction rate and good sealing performance. When the mass ratio of Al(H2PO4)3 matrix to CuO is 5.0:4.5, the adhesive airtightness is 0.15 MPa (not upper limit).
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Key words:
- adhesive /
- curing agent /
- airtightness /
- curing temperature /
- calcination
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图 1 MgO在不同温度煅烧下的显微组织形貌：（a）80 ℃；（b）1200 ℃；（c）1500 ℃
Figure 1. Microstructures of MgO calcined at different temperatures: (a) 80 ℃; (b) 1200 ℃; (c) 1500 ℃
图 2 Al(H2PO4)3–Al2O3胶黏剂体系在不同固化温度下显微组织形貌：（a）80 ℃；（b）1200 ℃
Figure 2. Microstructures of Al(H2PO4)3–Al2O3 adhesive system at different curing temperatures: (a) 80 ℃; (b) 1200 ℃
图 3 CuO质量分数对胶黏剂密封性的影响
Figure 3. Effect of CuO content by mass on the sealing performance of adhesive
图 4 CuO煅烧前后对胶黏剂密封性能的影响
Figure 4. Effect of CuO on the sealing performance of adhesive before and after calcining
图 5 Al(H2PO4)3–CuO胶黏剂体系的热重–差热分析曲线
Figure 5. TG–DTA curve of Al(H2PO4)3– CuO adhesive system
表 1 MgO煅烧前后对胶黏剂密封性能的影响
Table 1. Effect of MgO on the sealing performance of adhesive before and after calcining
未做高温处理 1200 ℃，煅烧2 h 1500 ℃，煅烧2 h 在室温下，胶料瞬间固化，无法涂刷，放出大量的热量 在室温下，胶料在1 min后完全固化，无法涂刷 胶料在2 min后完全固化，可涂刷2个试件，烧成收缩率大，无气密性 
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表 2 Al2O3质量分数对胶黏剂密封性能的影响
Table 2. Effect of Al2O3 content by mass on the sealing performance of adhesive
基料与固化剂质量比 胶料状态 气密性 5.0:2.5 在室温下，24 h固化，胶料流动性能好，可涂刷，有裂纹 0 5:3 室温下，24 h固化，胶料流动性能减弱，可涂刷 0.020 MPa 5.0:3.5 室温下，24 h固化，胶料的胶黏性上升，可涂刷 0.053 MPa 5:4 室温下，24 h固化，胶料的胶黏性增大，可涂刷 0.058 MPa 5.0:4.5 室温下，24 h固化，胶料的流动性差，可涂刷，胶黏性强，有裂纹 0
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