Study of electroless plating Cu by reduced graphene oxide and the effects on the microstructures and properties of RGO/Cu composites
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摘要: 以还原氧化石墨烯（reduced graphene oxide，RGO）和CuSO4·5H2O为主要原料，通过化学镀法得到铜包覆RGO复合粉体，再与铜粉混合得到含有不同质量分数RGO（0.2%、0.4%、0.6%、0.8%）的RGO/Cu粉末混合料，经压制及烧结得到RGO/Cu复合材料。通过X射线衍射仪（X-ray diffraction，XRD）、拉曼光谱仪（Raman spectroscopy，RS）和场发射扫描电镜（field emission scanning electron microscope，FESEM）等对RGO/Cu复合材料的微观组织和相关性能进行测试分析，并与由未镀铜处理的RGO所制备的RGO/Cu复合材料的组织性能进行对比。结果表明，经化学镀处理的RGO在RGO/Cu复合材料中分布较均匀，而未镀铜处理的RGO在基体中发生明显的团聚。RGO/Cu复合材料的导电导热性随石墨烯加入量的增加有所下降，但石墨烯的加入可有效提高RGO/Cu复合材料的力学性能，且由镀铜RGO所制备的RGO/Cu复合材料的性能要优于由未处理RGO所制备的RGO/Cu复合材料的性能。此外，RGO加入量对复合材料性能也有明显影响，当添加RGO质量分数为0.4%时，由镀铜RGO所制备的RGO/Cu复合材料的综合性能达到最好，其电导率达95.01% IACS，热导率达415.5W·（m·K）-1，而压缩屈服强度和抗拉强度分别为156.73 MPa和268.62 MPa，较相同工艺条件制备的纯铜的屈服强度（75 MPa）和抗拉强度（234.64 MPa）提升了109%和14.48%。Abstract: The copper-coated reduced graphene oxide (RGO) composite powders were obtained by electroless plating method in this paper, using RGO and CuSO4·5H2O as the main raw materials. The mixed RGO/Cu powders were obtained by added RGO in different mass fractions (0.2%, 0.4%, 0.6%, 0.8%). RGO/Cu composite materials were prepared by pressing and sintering. Compared with the RGO/Cu composite materials without copper-coated on RGO, the microstructures and performances of RGO/Cu composite materials were tested and analyzed by X-ray diffraction, Raman spectroscopy, and field emission scanning electron microscope. The results show that, the copper-coated RGO powders disperse uniformly in the RGO/Cu composites, while the copper-uncoated RGO agglomerates seriously in the Cu matrix. The mechanical properties of composites improve with the addition of RGO, while the electrical and thermal conductivity of the RGO/Cu composites decrease with the increase of RGO content. Properties of the RGO/Cu composites prepared by copper-coated RGO are better than those of RGO/Cu composites prepared by the Cu-unplated RGO. The maximum comprehensive performances of RGO/Cu composites prepared by copper-coated RGO in RGO mass fraction of 0.4% are obtained, and the compressive yield strength and tensile strength reach 156.73 and 268.62 MPa, respectively, which increase by 109% and 14.48%, compared with the pure copper yield strength (75 MPa) and tensile strength (234.64 MPa) obtained in the same conditions, the electrical conductivity reaches 95.01% IACS and the thermal conductivity is 415.5 W·(m·K)-1.
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Key words:
- graphene /
- electroless plating /
- copper-based composites /
- microstructures /
- physical properties
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图 1 RGO、镀铜RGO和RGO/Cu混合粉体的X射线衍射图谱
Figure 1. XRD patterns of RGO, Cu-coated RGO, and RGO/Cu mixing powders
图 2 RGO、镀铜RGO和RGO/Cu混合粉体的拉曼光谱图
Figure 2. Raman spectra of RGO, Cu-coated RGO, and RGO/Cu mixing powders
图 3 RGO、镀铜RGO, 和RGO/Cu混合粉体的扫描电子显微形貌: (a), (d) RGO; (b), (e) RGO/Cu混合粉体; (c), (f) 镀铜RGO
Figure 3. SEM morphology of RGO, Cu-coated RGO powders, and RGO/Cu mixing powders: (a), (d) RGO; (b), (e) RGO/Cu mixing powders; (d), (f) Cu-coated RGO powders
图 4 不同RGO/Cu粉末混合料制备RGO/Cu复合材料的相对密度
Figure 4. Relative density of RGO/Cu composites prepared by different RGO/Cu mixing powders
图 5 RGO/Cu复合材料的表面背散射扫描电子显微形貌: (a), (b) 由未处理RGO所制备的RGO/Cu复合材料; (c), (d) 由镀铜RGO所制备的RGO/Cu复合材料
Figure 5. Backscatter SEM morphology of RGO/Cu composites: (a), (b) RGO/Cu composites prepared by Cu-unplated RGO powders; (c), (d) RGO/Cu composites prepared by Cu-coated RGO
图 6 纯铜和RGO/Cu复合材料的拉伸断口图: (a), (d) 纯铜; (b), (e) 由未处理RGO (质量分数为0.4%) 所制备的RGO/Cu复合材料; (c), (f) 由镀铜RGO (质量分数为0.4%) 所制备的RGO/Cu复合材料
Figure 6. Fracture morphologies of pure copper and RGO/Cu composites: (a), (d) pure copper; (b), (e) RGO/Cu composites prepared by Cu-unplated RGO (mass fraction of 0.4%); (c), (f) RGO/Cu composites prepared by Cu-coated RGO (mass fraction of 0.4%)
图 7 不同RGO/Cu粉末混合料制备的RGO/Cu复合材料电导率(a) 和热导率(b)
Figure 7. Electrical conductivity (a) and thermal conductivity (b) of RGO/Cu composites prepared by different RGO/Cu mixing powders
图 8 不同RGO/Cu粉末混合料所制备RGO/Cu复合材料的压缩应力–应变曲线(A) 及压缩屈服强度(B)
Figure 8. Compressive stress–strain curves (A) and compressive yield strength (B) of RGO/Cu composites prepared by different RGO/Cu mixing powders
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