Effect of temperature distribution on pitting damage of copper-based friction material
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摘要: 通过离合器惯性实验台耐热实验，结合对非均质粉末冶金摩擦层结构模型和温度场的分析结果，研究了特定工况下的铜基粉末冶金摩擦副点蚀损伤现象，分析了温度分布对摩擦材料点蚀损伤的影响。结果表明：湿式铜基摩擦材料在长时间过载或热负荷集中时，由于摩擦表面产生局部高温，摩擦层内部产生较大的温度梯度和热应力，在铜基体与石墨接触区域会产生裂纹并出现铜基体的脱落与转移，发生点蚀；摩擦层上的点蚀程度由外侧向内侧逐渐加重后再减轻，中部点蚀现象最严重；在同一道摩擦层上，距离径向油槽较远区域的点蚀现象严重。Abstract: The pitting damage of copper-based friction material by powder metallurgy was investigated in specific working conditions by the combination of clutch inertia test, the structure model of heterogeneous friction layer by powder metallurgy, and the temperature field of friction layer. The effect of temperature distribution on the pitting damage of friction materials was analyzed. The results show that, the pitting phenomenon occurs because of the temperature gradient and heat stress, resulting from the bonding areas of copper and graphite, when the wet copper-base friction material is overloaded or superheated. The pitting degree of the friction layer is gradually reduced from the lateral to the inside, and the most serious pitting phenomenon appears in the middle. In the same friction channel, the pitting phenomenon is more seriously far away from the radial oil groove.
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Key words:
- copper-based friction materials /
- powder metallurgy /
- pitting /
- temperature field /
- oil grooves
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图 1 1铜基粉末冶金摩擦片宏观形貌
Figure 1. Macro-morphology of Cu-based friction disk by powder metallurgy
图 3 2点蚀损伤宏观形貌：（a）摩擦片；（b）对偶片
Figure 3. Macro-morphology of pitting damage: (a) friction disk; (b) dual disc
图 4 摩擦层表面形貌：（a）1道；（b）2道；（c）3道；（d）4道；（e）5道；（f）6道；（g）7道；(h）8道
Figure 4. Surface morphology of friction layer: (a) course 1; (b) course 2; (c) course 3; (d) course 4; (e) course 5; (f) course 6; (g) course 7; (h) course 8
图 5 摩擦层表面形貌：（a）3道；（b）5道
Figure 5. Surface morphology of friction disk: (a) course 3; (b) course 5
图 6 非均质摩擦层温度场：（a）0.05 s；（b）0.10 s
Figure 6. Temperature field of inhomogeneous friction layer: (a) 0.05 s; (b) 0.10 s
表 1 铜基摩擦材料化学成分（质量分数）
Table 1. Chemical composition of Cu-based friction materials
% Cu SiO2 Sn 石墨 78 3 4 15 
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