搅拌球磨磨制片状银粉工艺研究

张晓烨 钟翔 陈学刚 胡楠 王军 柴智渊

张晓烨, 钟翔, 陈学刚, 胡楠, 王军, 柴智渊. 搅拌球磨磨制片状银粉工艺研究[J]. 粉末冶金技术, 2019, 37(2): 134-139. doi: 10.19591/j.cnki.cn11-1974/tf.2019.02.009
引用本文: 张晓烨, 钟翔, 陈学刚, 胡楠, 王军, 柴智渊. 搅拌球磨磨制片状银粉工艺研究[J]. 粉末冶金技术, 2019, 37(2): 134-139. doi: 10.19591/j.cnki.cn11-1974/tf.2019.02.009
ZHANG Xiao-ye, ZHONG Xiang, CHEN Xue-gang, HU Nan, WANG Jun, CHAI Zhi-yuan. Research on the process of grinding flake silver powder by ball-stirring mill[J]. Powder Metallurgy Technology, 2019, 37(2): 134-139. doi: 10.19591/j.cnki.cn11-1974/tf.2019.02.009
Citation: ZHANG Xiao-ye, ZHONG Xiang, CHEN Xue-gang, HU Nan, WANG Jun, CHAI Zhi-yuan. Research on the process of grinding flake silver powder by ball-stirring mill[J]. Powder Metallurgy Technology, 2019, 37(2): 134-139. doi: 10.19591/j.cnki.cn11-1974/tf.2019.02.009

搅拌球磨磨制片状银粉工艺研究

doi: 10.19591/j.cnki.cn11-1974/tf.2019.02.009
详细信息
    通讯作者:

    张晓烨, E-mail: xyzhang1106@163.com

  • 中图分类号: TF123

Research on the process of grinding flake silver powder by ball-stirring mill

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  • 摘要: 通过搅拌球磨的方式在不同球磨助剂及球磨时间下,利用不同比表面积的前驱体磨制了片状银粉。采用激光粒度分布仪、扫描电子显微镜、比表面测试仪及松装、振实密度测试仪等设备研究了片状银粉的物理性能及导电性。结果表明:在球磨介质、料球比确定的前提下,使用比表面积为0.50 m2/g左右、分散性良好的类球形银粉为前驱体,以硬脂酸为球磨助剂,控制球磨时间为12 h,可制备得到方阻值不高于15 Ω/□的片状银粉,该银粉适用于导电银浆。
  • 图  1  立式搅拌球磨机内部结构

    Figure  1.  Internal structure of mixing ball mill

    图  2  不同比表面积球磨前驱体微观形貌:(a)A型前驱体;(b)B型前驱体

    Figure  2.  Microstructures of ball milling precursors in different specific surface areas: (a) type A; (b) type B

    图  3  不同比表面积球磨前驱体磨制后的片状银粉微观形貌:(a)AF;(b)BF

    Figure  3.  Microstructures of silver powders prepared by ball milling precursor in different specific surface areas: (a) AF; (b) BF

    图  4  三体磨料磨损示意图

    Figure  4.  Sketch map of three body abrasive wear

    图  5  不同球磨助剂磨制后银粉微观形貌:(a)油酸;(b)硬脂酸

    Figure  5.  Microstructures of silver powders prepared by different milling aids: (a) oleinic acid; (b) stearic acid

    图  6  银粉粒径与球磨时间的关系

    Figure  6.  Relationship between particle size and ball milling time of silver powders

    图  7  银粉比表面积与球磨时间的关系

    Figure  7.  Relationship between specific surface area and ball milling time of silver powders

    图  8  银粉方阻与球磨时间的关系

    Figure  8.  Relationship between electrical conductivity and ball milling time of silver powders

    表  1  不同比表面积的球磨前驱体磨制后银粉物理性能

    Table  1.   Physical properties of silver powders prepared by ball milling precursors in different specific surface areas

    型号 松装密度/(g·cm‒3) 比表面积/(m2·g‒1) 黏度/(MPa·s‒1) 方阻/(mΩ·□‒1) 印刷线条外观
    AF 0.53 2.49 36.1 17.69
    BF 0.61 1.68 25.5 12.41
    下载: 导出CSV

    表  2  不同球磨助剂磨制后银粉性能参及导电性数

    Table  2.   Properties and electrical conductivity of silver powders prepared by different milling aids

    助剂 松装密度/(g·cm‒3) 比表面积/(m2·g‒1) D4, 3/μm 方阻/(mΩ·□‒1)
    油酸 1.09 1.31 4.596 20.71
    硬脂酸 0.70 1.50 3.573 13.43
    下载: 导出CSV
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  • 收稿日期:  2018-05-25
  • 刊出日期:  2019-04-27

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