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摘要: 利用有限元分析软件ANSYS，对表面镀钨金刚石/铜复合材料进行了数值模拟，研究了金刚石体积分数、金刚石粒径及镀层厚度对表面镀钨金刚石/铜复合材料导热系数和热膨胀系数的影响。结果表明：随着金刚石体积分数的增加、金刚石粒径的增大、镀层厚度的减小，复合材料的导热系数呈现出增加的趋势，与文献数据的变化趋势相符，热膨胀系数受金刚石体积分数影响最大，金刚石粒径选在150~200 μm较为合适。Abstract: The tungsten-coated diamond/copper composites were simulated by the finite element analysis software ANSYS in this paper. The effects of diamond volume fraction, diamond particle size, and tungsten coating thickness on the thermal conductivity and thermal expansion coefficient of the diamond/copper composites were investigated. The results show that, the thermal conductivity of the composites increases as the increase of the diamond volume fraction and diamond particle size and as the decrease in the coating thickness of tungsten. The thermal expansion coefficient is mainly controlled by the volume fraction of diamond. The simulation results fit the literature data very well. The simulation results also indicate that the diamond particle size in 150~200 μm is optimal.
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图 1 有限元模拟中金刚石三维立体模型示意图
Figure 1. Schematic diagram of 3D diamond model in finite element simulation
图 2 有限元模拟中镀钨金刚石/铜三维立体模型示意图
Figure 2. Schematic diagram of 3D tungsten-coated diamond/ copper model in finite element simulation
图 3 金刚石体积分数与复合材料导热系数和热膨胀系数的关系
Figure 3. Relationship between the diamond volume fraction, thermal conductivity, and thermal expansion coefficient of the composites
图 4 金刚石粒径与复合材料导热系数和热膨胀系数关系
Figure 4. Relationship between the diamond diameter, thermal conductivity, and thermal expansion coefficient of the composites
图 5 镀层厚度与复合材料导热系数和热膨胀系数的关系
Figure 5. Relationship between the tungsten coating thickness, thermal conductivity, and thermal expansion coefficient of the composites
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