Study on the microstructure and properties of dispersion-reinforced Cu-based composites by ultrafine WC and nano-sized Al2O3 particles via extrusion densification
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摘要: 以纳米Al2O3颗粒、超细WC粉末、工业纯Cu粉末为原料, 通过热挤压致密获得了超细WC/纳米Al2O3弥散强化铜基(WC-Al2O3/Cu)复合材料, 研究了挤压态WC-Al2O3/Cu复合材料的微观组织及力学性能。结果表明: 成分为5% WC-2% Al2O3/Cu和10% WC-2% Al2O3/Cu (质量分数)的两种原料粉末, 经机械球磨、冷压、真空烧结和热挤压后, 其相对密度均达到了99%以上, 超细WC和纳米Al2O3强化相颗粒呈均匀弥散分布, 具有很好的导电性及力学性能; 其中, 5% WC-2% Al2O3/Cu复合材料的综合性能更佳, 其抗拉强度达到235.06 MPa, 延伸率为15.47%, 导电率可达85.28% IACS, 软化温度不低于900℃。Abstract: The dispersion-reinforced Cu-based composites by ultrafine WC and nano-sized Al2O3 particles (WC-Al2O3/Cu)were obtained by hot extrusion densification using the nano-sized Al2O3 particles, ultrafine WC powders, and industrial pure copper powders as raw materials. The microstructures and performances of the extruded WC-Al2O3/Cu composites were investigated. In the results, the relative density of the 5%WC-2%Al2O3/Cu and 10%WC-2%Al2O3/Cu composites by mass is over99% after mechanical milling, cold pressing, vacuum sintering, and hot extrusion. At this meantime, the ultrafine WC and nano-sized Al2O3 particles distribute homogenously in the Cu matrix, resulting in high mechanical strength and excellent electrical conductivity. The tensile strength, elongation, and electrical conductivity of 5%WC-2%Al2O3/Cu composites are 235.06 MPa, 15.47%, and 85.28% IACS, respectively, and the softening temperature is above 900℃, showing a better comprehensive performances.
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表 1 挤压态5%WC-2%Al2O3/Cu和10%WC-2%Al2O3/Cu复合材料的综合性能对比
Table 1. Comparison of the comprehensive property between the extruded 5%WC-2%Al2O3/Cu and 10%WC-2%Al2O3/Cu composites
材料 硬度,HV 相对密度/ % 抗拉强度/ MPa 延伸率/ % 软化温度/ ℃ 导电率/ (% IACS) 5%WC-2%Al2O3/Cu 153.7 99.53 235.06 15.47 > 900 85.28 10%WC-2%Al2O3/Cu 156.7 99.05 244.44 14.68 > 900 77.41 -
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