超高转速等离子旋转电极工艺制备钬铜球形粉末的研究

摘要: 采用超高转速等离子旋转电极工艺(supreme-speed plasma rotating electrode process, SS-PREP)制备韧性金属间化合物钬铜(HoCu)球形粉末, 粉末粒度在15~106μm之间。利用X射线衍射仪、扫描电子显微镜、能谱分析及光学显微镜分析了SS-PREP钬铜球形粉末的粒度分布、松装密度、振实密度及霍尔流速等粉末特性, 比较了不同试验方法对粒度分布的表征。结果表明, SS-PREP钬铜粉末主要由CsCl结构的RM型B2相构成, 不同粒度的HoCu球形颗粒化学成分基本一致, 随着粉末粒度增大, HoCu球形粉末的非球形颗粒比例呈现下降趋势。
- 钬铜粉末 /
- 等离子旋转电极工艺 /
- 粒度分布 /
- 增材制造
Abstract: The spherical HoCu powders as the ductile intermetallic compounds were prepared by the supreme-speed plasma rotating electrode process (SS-PREP) with the particle sizes of 15~106 μm without sieving. The particle size distribution, apparent density, tap density, and Hall flowability of the SS-PREP HoCu powders were investigated by X-ray diffraction (XRD), scanning electron microscope (SEM), energy disperse spectroscope (EDS), and optical microscope (OM). The particle size distribution characterized by the different test methods were compared and analyzed. The results show that, all of the SS-PREP HoCu powders consist of B2 phase in RM style with CsCl structure; the chemical compositions of HoCu powders in different particle sizes remain nearly constant; with the increase of powder sizes, the proportion of non-spherical HoCu particles decrease.
- HoCu powders /
- supreme-speed plasma rotating electrode process /
- particle size distribution /
- additive manufacturing

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图 1 钬铜合金晶体结构

Figure 1. Crystal structure of the HoCu alloys

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图 2 HoCu电极棒形貌：(a) 铝纸真空封装；(b) 电极棒外观形貌

Figure 2. Appearance of the HoCu electrode bar: (a) the vacuum packaging by aluminum foil; (b) the macro-morphology

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图 3 超高转速等离子旋转电极设备示意图(a)和实物图(b)

Figure 3. Schematic (a) and product (b) drawings of the SS-PREP equipment

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图 4 不同筛分方法得到的HoCu粉末粒度分布(0~150 μm): (a) 激光衍射法；(b) 干筛法；(c) 标尺标定

Figure 4. Particle size distribution of the HoCu powders in 0~150 μm characterized by the different test methods: (a) laser diffraction method; (b) dry screening method; (c) scale measurement

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图 5 HoCu粉末X射线衍射分析(CsCl型)

Figure 5. X-ray diffraction of the HoCu powders(type CsCl)

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图 6 HoCu粉末不同粒度区间的二次电子像：(a) 0~45 μm; (b) 45~106 μm; (c) 106~150 μm; (d) ~128 μm

Figure 6. Secondary electron images of the HoCu powders in the different particle size distribution: (a) 0~45 μm; (b) 45~106 μm; (c) 106~150 μm; (d) ~128 μm

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图 7 HoCu粉末不同粒度区间能谱分析：(a) 0~45 μm; (b) 45~106 μm; (c) 106~150 μm

Figure 7. EDS analysis of the HoCu powders in the different particle size distribution: (a) 0~45 μm; (b) 45~106 μm; (c) 106~150 μm

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图 8 HoCu粉末光学显微金相组织：(a) 低倍；(b) 高倍

Figure 8. Optical microstructure of the HoCu powders: (a) low magnification; (b) high magnification

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表 1 HoCu电极棒与粉末化学成分(质量分数)

Table 1. Chemical composition of the HoCu bars and powders by mass %

元素	Ho	Al	Fe	Si	O	Cu
HoCu电极棒	72.3	< 0.002	< 0.015	< 0.01	0.09	余量
SS-PREP制备的HoCu球形粉末	72.0	< 0.002	< 0.015	< 0.01	0.12	余量

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表 2 SS-PREP HoCu粉末性能

Table 2. Properties of the SS-PREP HoCu powders

粉末粒度/μm	霍尔流速/[(50 g)·s^-1]	松装密度/(g·cm^-3)	振实密度/(g·cm^-3)	安息角
0~150	11.1	5.51	5.79	—

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表 3 不同筛分方法得到的HoCu粉末粒度分布(0~150 μm)

Table 3. Particle size distribution of the HoCu powders in0~150 μm characterized by the different test methods

粒度/μm	干筛法粒度分布(质量分数)/%			激光衍射法粒度分布(体积分数)/%
粒度/μm	中航工业540厂	美国泰勒	德国莱驰	丹东百特
0~45	12.01	11.47	9.47	6.96
45~53	6.75	7.47	6.75	13.90
53~63	13.41	12.39	12.37	16.83
63~75	12.24	18.25	13.71	16.82
75~90	42.46	36.50	40.38	19.67
90~106	11.50	13.45	16.58	13.10
106~150	0.20	0.47	0.74	12.18

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