Research on diffusion bonding of FGH91 powder metallurgy superalloy and K418B castedblade by hot isostatic pressing
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摘要: 采用热等静压工艺进行了FGH91粉末高温合金和K418B铸造叶环扩散连接试验，研究了FGH91-K418B双合金的界面成分扩散和连接接头的组织和力学性能。结果表明，在连接界面足够清洁的条件下，选择1190 ℃+170 MPa的热等静压工艺，可以实现FGH91和K418B两种合金良好的冶金连接。进一步观察和分析发现，扩散连接接头致密完整，无夹杂物和连续的第二相析出物，扩散区宽度80～120 μm。FGH91-K418B双合金的拉伸性能、持久性能和显微组织具有良好的一致性，试样断裂均未发生在界面结合处。Abstract: The diffusion bonding test of FGH91 powder metallurgy (PM) superalloy and K418B castedblade was carried out by hot isostatic pressing (HIP). The elemental diffusion at the interface of FGH91-K418B dual alloys and the microstructure and mechanical properties of the joint were investigated. The results show that, under the condition that the bonding interface is clean enough and the HIP process is 1190 ℃+170 MPa, the good metallurgical bonding of FGH91 and K418B can be achieved. In addition, the diffusion bonding joint is compact and complete, and no inclusions and continuous second-phase precipitates are found. The width of the diffusion zone is in the range of 80~120 μm. The FGH91-K418B dual alloys have the good consistency of tensile properties, stress rupture properties, and microstructure, and the fracture does not occur at the interface joint.
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Key words:
- powder metallurgy superalloy /
- castedblade /
- blisk /
- hot isostatic pressing /
- diffusion bonding
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图 1 FGH91-K418B双合金整体叶盘模拟件
Figure 1. Simulated component of the FGH91-K418B dual alloy blisk
图 2 不同热等静压温度下双合金界面抛光态金相组织：（a）1160 ℃；（b）1175 ℃；（c）1190 ℃；（d）1205 ℃
Figure 2. As-polished morphologies of the dual alloy interface at different HIP temperatures: (a) 1160 ℃; (b) 1175 ℃; (c) 1190 ℃; (d) 1205 ℃
图 3 热等静压温度1190 ℃下双合金界面腐蚀态金相组织：（a）宏观图；（b）局部放大图
Figure 3. As-corroded morphologies of the dual alloy interface by HIP at 1190 ℃: (a) macrograph; (b) partial enlarged view
图 4 FGH91与K418B合金扩散连接接头显徽组织
Figure 4. Microstructures of the diffusion bonding joint between FGH91 and K418B alloys
图 5 FGH91-K418B连接界面显微形貌（a）及元素成分分布（（b）和（c））
Figure 5. SEM micrograph (a) and the elemental distribution ((b) and (c)) at the bonding interface
图 6 热等静压前后K418B合金γ′相的显微形貌：（a）HIP前；（b）HIP后
Figure 6. SEM images of γ′ phase in K418B alloys before and after HIP: (a) before HIP; (b) after HIP
图 7 单合金盘（a）与双合金盘（b）中FGH91合金γ′相显微组织
Figure 7. SEM images of γ′ phase in FGH91 alloys of the single alloy disk (a) and the dual alloy disk (b)
图 8 拉伸测试后FGH91-K418B复合试样：（a）室温；（b）540 ℃
Figure 8. FGH91-K418B samples after the tensile testing: (a) room temperature; (b) 540 ℃
图 9 持久测试后FGH91（a）、K418B（b）以及FGH91-K418B（c）复合试样
Figure 9. FGH91 (a), K418B (b), and FGH91-K418B (c) samples after the rupture testing
表 1 实验用FGH91合金和K418B合金化学成分（质量分数）
Table 1. Chemical composition of FGH91 and K418B alloys
% 合金 元素 Al Co Cr C Ti Mo Nb Zr Ni FGH91 4.00 17.42 14.99 0.034 3.48 4.94 — — 余量 K418B 6.10 — 11.80 0.050 0.80 4.50 2.10 0.09 余量 
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表 2 FGH91与K418B扩散连接的相关常数
Table 2. Related constants of diffusion bonding FGH91 and K418B
元素 扩散系数，
D / 10−14
(m2·s−1)FGH91成分含量 K418B成分含量 质量分数 /
%体积浓度 /
(kg·m−3)质量分数 /
%体积浓度/
(kg·m−3)Cr 2.408070 15.00 120150.0 11.82 94678.2 Co 1.640580 17.34 138893.4 0 0 Mo 0.433107 5.02 40210.2 4.58 36685.8 Al 5.961280 4.02 32200.2 6.04 48380.4 Ti 1.483150 3.63 29076.3 0.72 5767.2 Nb 1.141570 0 0 2.08 16660.8 Ni 1.356680 54.93 439989.3 74.69 598266.9
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表 3 FGH91-K418B双合金整体叶盘模拟件拉伸性能
Table 3. Tensile properties of the FGH91-K418B dual alloy blisk
温度 / ℃ σp0.2 / MPa σb / MPa δ5 / % Ψ / % 备注 25 703 814 5.9 12.7 断在K418B一侧 540 724 862 6.5 10.1 断在K418B一侧 760 687 861 6.2 7.6 断在K418B一侧 注：σp0.2为屈服强度，σb为拉伸强度，δ5为伸长率，Ψ为面收缩率。
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表 4 FGH91-K418B双合金整体叶盘模拟件持久性能
Table 4. Stress rupture properties of the FGH91-K418B dual alloy blisk
温度 /
℃试样 应力 /
MPa持续时间 /
h延伸率 /
%备注 760 K418B合金 530 299.58 9.48 实测值 530 ≥50 ≥2 技术标准要求 760 FGH91合金 586 28.50 11.68 实测值 586 ≥15 ≥8 技术标准要求 760 FGH91-K418B
复合试样586 27.17 13.28 断在FGH91
一侧
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