Fabrication, microstructure and properties of W-Cu gradient composites
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摘要: 通过设计不同比例W/Cu粉末配比，经过混粉、放电等离子烧结后制备了三层的W-Cu梯度复合材料。研究了不同烧结温度下W-Cu梯度复合材料的微观组织、界面、物理性能、力学性能及抗热震性能等。结果表明：在900 ℃烧结时W-Cu梯度复合材料致密度高（95%）且保持了单层的原始设计成分。每个梯度层中W、Cu 分布较均匀，W、Cu之间界面结合良好，未发生扩散。W-Cu梯度复合材料的力学性能呈梯度分布，W-40Cu层的显微硬度最高为136 Hv。复合材料在压缩工程中W-40Cu层首先发生断裂，最高压缩屈服强度为378 MPa。在900 ℃烧结制备的W-Cu梯度复合材料的热导率为202 (W·m-1·k-1)。复合材料经抗热震实验后，界面处无裂纹，具有良好的抗热震性能。
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关键词:
Abstract: Three-layer W-Cu gradient composites were prepared by designing different ratios of W / Cu powder, mixing and spark plasma sintering. The microstructure, interface, physical properties, mechanical properties and thermal shock resistance of W-Cu gradient composites at different sintering temperatures were investigated. The results show that，W-Cu gradient composite sintered at 900 °C has high density (95%) and maintains the original design composition of the single layer. The distribution of W and Cu in each gradient layer is uniform. The interface between W and Cu is well bonded without diffusion. The mechanical properties of the W-Cu gradient composite show gradient distribution, and the microhardness of the W-40Cu layer is up to 136 Hv. During the compression process, the W-40Cu layer of the composite firstly fractures, and the highest compressive yield strength is 378 MPa. The thermal conductivity of the W-Cu gradient composite sintered at 900 ℃ is 202 (W·m-1·k-1). After the thermal shock resistance test，W-Cu gradient composite has good thermal shock resistance performance without no crack at the interface. -
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