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Volume 38 Issue 1
Jul.  2021
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XIAO Chang-jiang, CHEN Yi-guang, LI Xiao-long, YAN Zi-yao. Method and mechanism analysis of improving the holding force between Ni-coated diamond and Cu-matrix bonding[J]. Powder Metallurgy Technology, 2020, 38(1): 25-29. DOI: 10.19591/j.cnki.cn11-1974/tf.2020.01.004
Citation: XIAO Chang-jiang, CHEN Yi-guang, LI Xiao-long, YAN Zi-yao. Method and mechanism analysis of improving the holding force between Ni-coated diamond and Cu-matrix bonding[J]. Powder Metallurgy Technology, 2020, 38(1): 25-29. DOI: 10.19591/j.cnki.cn11-1974/tf.2020.01.004
shu

Method and mechanism analysis of improving the holding force between Ni-coated diamond and Cu-matrix bonding

  • 1.

    School of Materials Science and Engineering, Henan University of Technology, Zhengzhou 450001, China

  • 2.

    Zhengzhou Coal Mining Machinery Group Co., Ltd., Zhengzhou 450001, China

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  • Corresponding author:

    XIAO Chang-jiang, E-mail: cjxiao@haut.edu.cn

  • Received Date: February 21, 2019
    Graphical Abstract
    • Abstract
  • To improve the holding force between the diamond and metal matrix bonding, the Ni-coated diamond was treated at 1050 for 1 h, th℃ en the diamond surface was cleaned by the concentrated nitric acid, finally, the Cu-matrix bonding diamond segments were prepared by vacuum hot-pressing sintering. The surface morphologies of diamond coatings before and after high temperature treatment were observed by scanning electron microscope. The flexural strength of Cu-matrix bonding diamond segments was measured to evaluate the holding force between diamond and Cu-matrix bonding. The phases between the coating and diamond after high temperature treatment were analyzed by X-ray diffraction. The results show that, the Ni coating treated at 1050 for 1 h mainly℃ maintains integral and the diamond surface was roughened. The flexural strength of Cu-matrix bonding diamond segments increases from 759 MPa for the uncoated diamond to 791 MPa for the Ni-coated diamond, and then to 833 MPa for the Ni-coated diamond after high temperature treatment, showing the effective improvement of the holding force between Ni-coated diamond and Cu-matrix bonding.
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    • References (15)
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