DIFFUSION BONDING OF W-Cu TO Cu AND CuCr_0.7 BY HIP PROCESSING

Diffusion bonding of W-Cu composites containing 10%-40% (wt) Cu to pure copper or CuCr_0.7 have been achieved by HIP processing. The tensile strength of specimen are approximate to or equal to that of copper (or CuCr_0.7). The bonding interface and fracture surface of tensile specimen have been investigated and some of mechanical and physical properties of Cu(or CuCr_0.7) have been analyzed. The problems concerning the quality of bonding have been discussed. The experimental results show that Cr is effective on diffusion and can improve the combined properties of bonded parts.