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LIU Shangyang, YANG Bo, MAO Jian. Thermal coupling analysis and residual stress prediction of aluminum alloy SLM[J]. Powder Metallurgy Technology.
Citation: LIU Shangyang, YANG Bo, MAO Jian. Thermal coupling analysis and residual stress prediction of aluminum alloy SLM[J]. Powder Metallurgy Technology.

Thermal coupling analysis and residual stress prediction of aluminum alloy SLM

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  • In this paper, the thermal and mechanical coupling analysis of AlSi10Mg SLM forming process is carried out by using ANSYS finite element analysis software and experimental verification is carried out. Aiming at the problem that SLM numerical simulation of aluminum alloy is not accurate enough and the residual stress prediction efficiency is low, JMatPro software is used to calculate the nonlinear thermal physical property parameters of AlSi10Mg at different temperatures, and the material state transformation is realized by UDMAT subroutine of ANSYS, so as to improve the accuracy of numerical simulation. The influence of different laser process parameters on temperature field and stress field was studied through the thermodynamic coupling numerical model established. Finally, the corresponding AlSi10Mg sample printing experiment was carried out, and the residual stress of the sample was measured by X-ray stress analyzer. The results show that there are obvious peaks in the curves during the scanning of each layer, and good remelting lap between tracks and layers can be achieved. With the decrease of scanning rate or the increase of laser power, the maximum temperature and molten pool size increase. In the forming process, the stress along the scanning direction is the largest, and the stress perpendicular to the scanning direction is the smallest. The error between the residual stress and the experimental value obtained by the thermodynamic coupling model is less than 8%. The residual stress of SLM can be predicted by the thermodynamic coupling model.
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