Effect of technological parameters on high indium and high tin silver-based brazing filler metal powders by electromagnetic compaction molding

The electromagnetic compaction process of high indium and high tin silver-based brazing filler metal powders was simulated by EDEM software, according to the theory of discrete element, the influences of technological parameters on Ag–Cu–Sn–In series brazing filler metal powders during the compaction process were investigated, the densification behavior of silver-based brazing filler metal powders was analyzed, and the effects of indium and tin on the relative density of compact was studied.The compaction process of Ag–19.5 Cu–15 In–15 Sn solder powders was simulated in different voltages and capacitance; the effects of discharge parameters on the relative density of compact were analyzed.Finally, the simulation was verified by preparing solder compact in the suppression equipment.The results show that, in the same compacting force, the higher the contents of indium by mass are, the higher the relative density of compact is; in the same capacitance, the higher the voltage is, the higher the relative density of compact is, but the amplification gradually slows down; in the same voltage, the higher the capacitance is, the higher the relative density of compact is, and the amplification is roughly constant.The verification results show that, the simulation error is less than 8%, the discrete element simulation model of brazing filler metal electromagnetic compaction has a certain reference value.